SNVS631D January   2010  – October 2016 LM5035C

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  High-Voltage Start-Up Regulator
      2. 8.3.2  Line Undervoltage Detector
      3. 8.3.3  Line Overvoltage, Load Overvoltage, and Remote Thermal Protection
      4. 8.3.4  Reference
      5. 8.3.5  Cycle-by-Cycle Current Limit
      6. 8.3.6  Overload Protection Timer
      7. 8.3.7  Soft Start
      8. 8.3.8  PWM Comparator
      9. 8.3.9  Feedforward Ramp and Volt • Second Clamp
      10. 8.3.10 Oscillator, Sync Capability
      11. 8.3.11 Gate Driver Outputs (HO and LO)
      12. 8.3.12 Synchronous Rectifier Control Outputs (SR1 and SR2)
      13. 8.3.13 Thermal Protection
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 VIN
        2. 9.2.2.2 For Applications >100 V
        3. 9.2.2.3 Current Sense
        4. 9.2.2.4 HO, HB, HS, and LO
        5. 9.2.2.5 Programmable Delay (DLY)
        6. 9.2.2.6 UVLO and OVP Voltage Divider Selection For R1, R2, and R3
        7. 9.2.2.7 Fault Protection
        8. 9.2.2.8 Hiccup Mode Current Limit Restart (RES)
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (March 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed HBM value from ±2000 to ±1500 in the ESD Ratings tableGo
  • Changed thermal values in the Thermal Information table to align with JEDEC standardsGo
  • Deleted THERMAL RESISTANCE section from the Electrical Characteristics tableGo

Changes from B Revision (March 2013) to C Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo