SNVS499 Data sheet | TI.com

SNVS499I February 2007 – November 2023 LM5116

PRODUCTION DATA

Package Options

Mechanical Data (Package|Pins)

PWP|20
- MHTS001G

Thermal pad, mechanical data (Package|Pins)

PWP|20
- PPTD289

Orderable Information

5.7 Typical Performance Characteristics

Figure 5-1 Typical Application Circuit Efficiency

Figure 5-3 Driver Dead-time vs Temperature

Figure 5-5 Driver Sink Current vs VCC

Figure 5-7 LO High R_DS(ON) vs VCC

Figure 5-9 LO Low R_DS(ON) vs VCC

Figure 5-11 Forced HO Off-time vs Temperature VCCX = 5 V

Figure 5-13 Frequency vs R_T

Figure 5-15 Frequency vs Temperature

Figure 5-17 Frequency vs Temperature

Figure 5-19 VIN Operating Current vs Temperature

Figure 5-21 VCC UVLO vs Temperature

Figure 5-23 VCC vs ICC

Figure 5-2 Driver Source Current vs VCC

Figure 5-4 HO High R_DS(ON) vs VCC

Figure 5-6 HO Low R_DS(ON) vs VCC

Figure 5-8 EN Input Threshold vs Temperature

Figure 5-10 HB to SW UVLO vs Temperature

Figure 5-12 HB DC Bias Current vs Temperature

Figure 5-14 Error Amp Gain vs Frequency

Figure 5-16 Error Amp Phase vs Frequency

Figure 5-18 Current Limit Threshold vs Temperature

Figure 5-20 VCC vs Temperature

Figure 5-22 VCC vs VIN

Figure 5-24 VCCX Switch R_DS(ON) vs VCCX