SLVSGN5A October   2022  – November 2025 LM51231-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Enable/Disable (EN, VH Pin)
      2. 6.3.2  High Voltage VCC Regulator (BIAS, VCC Pin)
      3. 6.3.3  Light Load Switching Mode Selection (MODE Pin)
      4. 6.3.4  VOUT Range Selection (RANGE Pin)
      5. 6.3.5  Line Undervoltage Lockout (UVLO Pin)
      6. 6.3.6  Fast Restart using VCC HOLD (VH Pin)
      7. 6.3.7  Adjustable Output Regulation Target (VOUT, TRK, VREF Pin)
      8. 6.3.8  Overvoltage Protection (VOUT Pin)
      9. 6.3.9  Power Good Indicator (PGOOD Pin)
      10. 6.3.10 Dynamically Programmable Switching Frequency (RT)
      11. 6.3.11 External Clock Synchronization (SYNC Pin)
      12. 6.3.12 Programmable Spread Spectrum (DITHER Pin)
      13. 6.3.13 Programmable Soft-start (SS Pin)
      14. 6.3.14 Wide Bandwidth Transconductance Error Amplifier and PWM (TRK, COMP Pin)
      15. 6.3.15 Current Sensing and Slope Compensation (CSP, CSN Pin)
      16. 6.3.16 Constant Peak Current Limit (CSP, CSN Pin)
      17. 6.3.17 Maximum Duty Cycle and Minimum Controllable On-time Limits
      18. 6.3.18 MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LO, HO, HB Pin)
      19. 6.3.19 Thermal Shutdown Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Status
        1. 6.4.1.1 Shutdown Mode
        2. 6.4.1.2 Configuration Mode
        3. 6.4.1.3 Active Mode
        4. 6.4.1.4 Bypass Mode
          1. 6.4.1.4.1 Bypass DE mode
          2. 6.4.1.4.2 Bypass FPWM
      2. 6.4.2 Light Load Switching Mode
        1. 6.4.2.1 Forced PWM (FPWM) Mode
        2. 6.4.2.2 Diode Emulation (DE) Mode
        3. 6.4.2.3 Forced Diode Emulation Operation in FPWM Mode
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Ideas
      4. 7.2.4 Application Curves
    3. 7.3 System Example
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 

Copyright © 2025, Texas Instruments Incorporated