SNVSC77 December   2024 LM5125-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Configuration (CFG0-pin, CFG1-pin, CFG2-pin)
      2. 6.3.2  Switching Frequency and Synchronization (SYNCIN)
      3. 6.3.3  Dual Random Spread Spectrum (DRSS)
      4. 6.3.4  Operation Modes (BYPASS, DEM, FPWM)
      5. 6.3.5  Dual- and Multi-phase Operation
      6. 6.3.6  BIAS (BIAS-pin)
      7. 6.3.7  Soft Start (SS-pin)
      8. 6.3.8  VOUT Programming (VOUT, ATRK, DTRK)
      9. 6.3.9  Protections
      10. 6.3.10 VOUT Overvoltage Protection (OVP)
      11. 6.3.11 Thermal Shutdown (TSD)
      12. 6.3.12 Power-Good Indicator (PGOOD-pin)
      13. 6.3.13 Current Sensing, Peak Current Limit, and Slope Compensation (CSP1, CSP2, CSN1, CSN2)
      14. 6.3.14 Current Sense Programming (CSP1, CSP2, CSN1, CSN2)
      15. 6.3.15 Input Current Limit and Monitoring (ILIM, IMON, DLY)
      16. 6.3.16 Signal Deglitch Overview
      17. 6.3.17 MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LOx, HOx, HBx-pin)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown State
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Feedback Compensation
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1  Determine the Total Phase Number
        2. 7.2.3.2  Determining the Duty Cycle
        3. 7.2.3.3  Timing Resistor RT
        4. 7.2.3.4  Inductor Selection Lm
        5. 7.2.3.5  Current Sense Resistor Rcs
        6. 7.2.3.6  Current Sense Filter RCSFP, RCSFN, CCS
        7. 7.2.3.7  Low-Side Power Switch QL
        8. 7.2.3.8  High-Side Power Switch QH and Additional Parallel Schottky Diode
        9. 7.2.3.9  Snubber Components
        10. 7.2.3.10 Vout Programming
        11. 7.2.3.11 Input Current Limit (ILIM/IMON)
        12. 7.2.3.12 UVLO Divider
        13. 7.2.3.13 Soft Start
        14. 7.2.3.14 CFG Settings
        15. 7.2.3.15 Output Capacitor Cout
        16. 7.2.3.16 Input Capacitor Cin
        17. 7.2.3.17 Bootstrap Capacitor
        18. 7.2.3.18 VCC Capacitor CVCC
        19. 7.2.3.19 BIAS Capacitor
        20. 7.2.3.20 VOUT Capacitor
        21. 7.2.3.21 Loop Compensation
      4. 7.2.4 Application Curves
        1. 7.2.4.1 Efficiency
        2. 7.2.4.2 Steady State Waveforms
        3. 7.2.4.3 Step Load Response
        4. 7.2.4.4 Sync Operation
        5. 7.2.4.5 Thermal Performance
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2.     85

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Power-Good Indicator (PGOOD-pin)

The device provides a power-good indicator (PGOOD) to simplify sequencing and supervision. PGOOD is an open-drain output and a pullup resistor can be externally connected. The PGOOD switch opens when the VOUT pin voltage is higher than the VUVP-H threshold. PGOOD is pulled low under the following conditions:

  • The VOUT-pin voltage is below the VOUT falling undervoltage threshold VUVP-L.
  • The VOUT-pin voltage is above the VOUT rising overvoltage threshold VOVP_H or VOVP_max-H and the PGOODOVP_enable function is enabled (see CFG1-pin Settings).
  • The device is in SHUTDOWN state and VBIAS is greater than approximately 1.7V (see Functional State Diagram).
  • The EN/UVLO-pin voltage is falling below the undervoltage lockout threshold voltage VUVLO-FALLING.
  • The VCC regulator voltage VCC falls below the undervoltage lockout threshold VVCC-UVLO-FALLING.
  • Thermal Shutdown is triggered (see Functional State Diagram).
  • The HBx-pin voltage is below the VHBx falling VHB-UVLO threshold and boot refresh enters the 512 cycles hiccup mode off time (see MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LOx, HOx, HBx-pin)). PGOOD is only pulled low during the Hiccup off-time.
  • The switch peak current limit is exceeded by 20% and the ICL_latch function is enabled (see CFG1-pin Settings).
  • An OTP memory fault occurred (CRC fault).
LM5125-Q1 PGOOD Status for All Device
                    States Figure 6-17 PGOOD Status for All Device States