SNVSCU2A August   2024  – August 2024 LM5137-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1. 5.1 Wettable Flanks
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range (VIN)
      2. 7.3.2  Bias Supply Regulator (VCC, BIAS1/VOUT1, VDDA)
      3. 7.3.3  Precision Enable (EN1, EN2)
      4. 7.3.4  Switching Frequency (RT)
      5. 7.3.5  Pulse Frequency Modulation and Synchronization (PFM/SYNC)
      6. 7.3.6  Synchronization Out (SYNCOUT)
      7. 7.3.7  Dual Random Spread Spectrum (DRSS)
      8. 7.3.8  Configurable Soft Start (RSS)
      9. 7.3.9  Output Voltage Setpoints (FB1, FB2)
      10. 7.3.10 Minimum Controllable On-Time
      11. 7.3.11 Error Amplifier and PWM Comparator (FB1, FB2, COMP1, COMP2)
        1. 7.3.11.1 Slope Compensation
      12. 7.3.12 Inductor Current Sense (ISNS1+, BIAS1/VOUT1, ISNS2+, VOUT2)
        1. 7.3.12.1 Shunt Current Sensing
        2. 7.3.12.2 Inductor DCR Current Sensing
      13. 7.3.13 MOSFET Gate Drivers (HO1, HO2, LO1, LO2)
      14. 7.3.14 Output Configurations (CNFG)
        1. 7.3.14.1 Independent Dual-Output Operation
        2. 7.3.14.2 Single-Output Interleaved Operation
        3. 7.3.14.3 Single-Output Multiphase Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode
      2. 7.4.2 PFM Mode
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Train Components
        1. 8.1.1.1 Power MOSFETs
        2. 8.1.1.2 Buck Inductor
        3. 8.1.1.3 Output Capacitors
        4. 8.1.1.4 Input Capacitors
        5. 8.1.1.5 EMI Filter
      2. 8.1.2 Error Amplifier and Compensation
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1 – Dual 5V and 3.3V, 20A Buck Regulator for 12V Automotive Battery Applications
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Custom Design With Excel Quickstart Tool
          3. 8.2.1.2.3 Inductor Calculations
          4. 8.2.1.2.4 Shunt Resistors
          5. 8.2.1.2.5 Ceramic Output Capacitors
          6. 8.2.1.2.6 Ceramic Input Capacitors
          7. 8.2.1.2.7 Feedback Resistors
          8. 8.2.1.2.8 Input Voltage UVLO Resistors
          9. 8.2.1.2.9 Compensation Components
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Design 2 – Two-Phase, Single-Output Buck Regulator for Automotive ADAS Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Design 3 – 12V, 20A, 400kHz, Two-Phase Buck Regulator for 48V Automotive Applications
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Stage Layout
        2. 8.4.1.2 Gate Drive Layout
        3. 8.4.1.3 PWM Controller Layout
        4. 8.4.1.4 Thermal Design and Layout
        5. 8.4.1.5 Ground Plane Design
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
        1. 9.2.1.1 PCB Layout Resources
        2. 9.2.1.2 Thermal Design Resources
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

PWM Controller Layout

With the proviso to locate the controller as close as possible to the power MOSFETs to minimize gate driver trace runs, the components related to the analog and feedback signals as well as current sensing are considered in the following:

  1. Separate power and signal traces, and use a ground plane to provide noise shielding.
  2. Place all sensitive analog traces and components related to COMP1/2, FB1/2, ISNS1/2+, RSS, and RT away from high-voltage switching nodes such as SW1/2, HO1/2, LO1/2 or CBOOT1/2 to avoid mutual coupling. Use internal layers as ground planes. Pay particular attention to shielding the feedback (FB) trace from power traces and components.
  3. Locate the upper and lower feedback resistors (if required) close to the respective FB pins, keeping the FB traces as short as possible. Route the trace from the upper feedback resistors to the required output voltage sense points at the loads.
  4. Route the [ISNS1+, BIAS1/VOUT1] and [ISNS2+, VOUT1/2] traces as differential pairs to minimize noise pickup and use Kelvin connections to the applicable shunt resistor (if shunt current sensing is used) or to the sense capacitor (if inductor DCR current sensing is used). In particular, use a wide trace for the connection to BIAS1/VOUT1, preferably 80mils (2mm), to minimize the voltage drop related to bias current flowing to that pin.
  5. Minimize the loop area from the VCC and VIN pins through the respective decoupling capacitors to the PGND pin. Locate these capacitors as close as possible to the LM5137-Q1.