SNVSCV0
September 2024
LM5137F-Q1
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Device and Documentation Support
5.1
Device Support
5.1.1
Third-Party Products Disclaimer
5.1.2
Development Support
5.1.2.1
Custom Design With WEBENCH® Tools
5.2
Documentation Support
5.2.1
Related Documentation
5.2.1.1
PCB Layout Resources
5.2.1.2
Thermal Design Resources
5.3
Receiving Notification of Documentation Updates
5.4
Support Resources
5.5
Trademarks
5.6
Electrostatic Discharge Caution
5.7
Glossary
6
Revision History
7
Mechanical, Packaging, and Orderable Information
7.1
Tape and Reel Information
Package Options
Mechanical Data (Package|Pins)
RHA|36
MPQF611A
Thermal pad, mechanical data (Package|Pins)
Orderable Information
snvscv0_oa
5.2.1.2
Thermal Design Resources
Application reports:
Texas Instruments,
AN-2020 Thermal Design by Insight, Not Hindsight
Texas Instruments,
AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
Texas Instruments,
Thermal Design Made Simple with LM43603 and LM43602
Texas Instruments,
PowerPAD™
Thermally Enhanced Package
Texas Instruments,
PowerPAD Made Easy
Texas Instruments,
Using New Thermal Metrics