SNVSB29C October   2018  – June 2021 LM5143-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1. 6.1 Wettable Flanks
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range (VIN)
      2. 8.3.2  High-Voltage Bias Supply Regulator (VCC, VCCX, VDDA)
      3. 8.3.3  Enable (EN1, EN2)
      4. 8.3.4  Power Good Monitor (PG1, PG2)
      5. 8.3.5  Switching Frequency (RT)
      6. 8.3.6  Clock Synchronization (DEMB)
      7. 8.3.7  Synchronization Out (SYNCOUT)
      8. 8.3.8  Spread Spectrum Frequency Modulation (DITH)
      9. 8.3.9  Configurable Soft Start (SS1, SS2)
      10. 8.3.10 Output Voltage Setpoint (FB1, FB2)
      11. 8.3.11 Minimum Controllable On-Time
      12. 8.3.12 Error Amplifier and PWM Comparator (FB1, FB2, COMP1, COMP2)
      13. 8.3.13 Slope Compensation
      14. 8.3.14 Inductor Current Sense (CS1, VOUT1, CS2, VOUT2)
        1. 8.3.14.1 Shunt Current Sensing
        2. 8.3.14.2 Inductor DCR Current Sensing
      15. 8.3.15 Hiccup Mode Current Limiting (RES)
      16. 8.3.16 High-Side and Low-Side Gate Drivers (HO1/2, LO1/2, HOL1/2, LOL1/2)
      17. 8.3.17 Output Configurations (MODE, FB2)
        1. 8.3.17.1 Independent Dual-Output Operation
        2. 8.3.17.2 Single-Output Interleaved Operation
        3. 8.3.17.3 Single-Output Multiphase Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Standby Modes
      2. 8.4.2 Diode Emulation Mode
      3. 8.4.3 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Power Train Components
        1. 9.1.1.1 Buck Inductor
        2. 9.1.1.2 Output Capacitors
        3. 9.1.1.3 Input Capacitors
        4. 9.1.1.4 Power MOSFETs
        5. 9.1.1.5 EMI Filter
      2. 9.1.2 Error Amplifier and Compensation
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 – High Efficiency, Dual-Output Buck Regulator for Automotive Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2 Custom Design With Excel Quickstart Tool
          3. 9.2.1.2.3 Inductor Calculation
          4. 9.2.1.2.4 Current-Sense Resistance
          5. 9.2.1.2.5 Output Capacitors
          6. 9.2.1.2.6 Input Capacitors
          7. 9.2.1.2.7 Compensation Components
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2 – Two-Phase, Single-Output Buck Regulator for Automotive ADAS Applications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedures
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Stage Layout
      2. 11.1.2 Gate-Drive Layout
      3. 11.1.3 PWM Controller Layout
      4. 11.1.4 Thermal Design and Layout
      5. 11.1.5 Ground Plane Design
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
      3. 12.1.3 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
        1. 12.2.1.1 PCB Layout Resources
        2. 12.2.1.2 Thermal Design Resources
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN to PGND –0.3 70 V
SW1, SW2 to PGND –0.3 70
SW1, SW2 to PGND (20-ns transient) –5
HB1 to SW1, HB2 to SW2 –0.3 6.5
HB1 to SW1, HB2 to SW2 (20-ns transient) –5
HO1 to SW1, HOL1 to SW1, HO2 to SW2, HOL2 to SW2 –0.3 VHB + 0.3
HO1 to SW1, HOL1 to SW1, HO2 to SW2, HOL2 to SW2 (20-ns transient) –5
LO1, LOL1, LO2, LOL2 to PGND –0.3 VVCC + 0.3
LO1, LOL1, LO2, LOL2 to PGND (20-ns transient) –1.5 VVCC + 0.3
SS1, SS2, COMP1, COMP2, RES, RT, MODE, DITH to AGND –0.3 VVDDA + 0.3
EN1, EN2 to PGND –0.3 70
VCC, VCCX, VDDA, PG1, PG2, DEMB, FB1, FB2 to AGND –0.3 6.5
VOUT1, VOUT2, CS1, CS2 –0.3 60
VOUT1 to CS1, VOUT2 to CS2 –0.3 0.3
PGND to AGND –0.3 0.3 V
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.