SNVSAY4F august   2018  – august 2023 LM5155-Q1 , LM51551-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Line Undervoltage Lockout (UVLO/SYNC Pin)
      2. 9.3.2  High Voltage VCC Regulator (BIAS, VCC Pin)
      3. 9.3.3  Soft Start (SS Pin)
      4. 9.3.4  Switching Frequency (RT Pin)
      5. 9.3.5  Clock Synchronization (UVLO/SYNC Pin)
      6. 9.3.6  Current Sense and Slope Compensation (CS Pin)
      7. 9.3.7  Current Limit and Minimum On-time (CS Pin)
      8. 9.3.8  Feedback and Error Amplifier (FB, COMP Pin)
      9. 9.3.9  Power-Good Indicator (PGOOD Pin)
      10. 9.3.10 Hiccup Mode Overload Protection (LM51551 Only)
      11. 9.3.11 Maximum Duty Cycle Limit and Minimum Input Supply Voltage
      12. 9.3.12 MOSFET Driver (GATE Pin)
      13. 9.3.13 Overvoltage Protection (OVP)
      14. 9.3.14 Thermal Shutdown (TSD)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 Standby Mode
      3. 9.4.3 Run Mode
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Custom Design With WEBENCH® Tools
        2. 10.2.2.2 Recommended Components
        3. 10.2.2.3 Inductor Selection (LM)
        4. 10.2.2.4 Output Capacitor (COUT)
        5. 10.2.2.5 Input Capacitor
        6. 10.2.2.6 MOSFET Selection
        7. 10.2.2.7 Diode Selection
        8. 10.2.2.8 Efficiency Estimation
      3. 10.2.3 Application Curve
    3. 10.3 System Examples
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
      2. 13.1.2 Development Support
        1. 13.1.2.1 Custom Design With WEBENCH® Tools
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Thermal Information

THERMAL METRIC (1) LM5155x-Q1 (WF) LM5155x-Q1 (NON-WF) UNIT
DSS0012C (WSON) DSS0012B (WSON)
12 PINS 12 PINS
RθJA Junction-to-ambient thermal resistance (LM5155EVM-BST) 37.0 N/A °C/W
RθJA Junction-to-ambient thermal resistance 60.3 63.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60.1 61.0 °C/W
RθJB Junction-to-board thermal resistance 28.8 32.1 °C/W
ψJT Junction-to-top characterization parameter (LM5155EVM-BST) 1.2 N/A °C/W
ψJT Junction-to-top characterization parameter 2.0 2.3 °C/W
ψJB Junction-to-board characterization parameter (LM5155EVM-BST) 18.7 N/A °C/W
ψJB Junction-to-board characterization parameter 28.7 31.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.1 11.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.