SNVSC75B April   2023  – September 2025 LM5171-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Bias Supplies and Voltage Reference (VCC, VDD, and VREF)
      2. 6.3.2  Undervoltage Lockout (UVLO)
      3. 6.3.3  Device Configurations (CFG)
      4. 6.3.4  High Voltage Inputs (HV1, HV2)
      5. 6.3.5  Current Sense Amplifier
      6. 6.3.6  Control Commands
        1. 6.3.6.1 Channel Enable Commands (EN1, EN2)
        2. 6.3.6.2 Direction Command (DIR1 and DIR2)
        3. 6.3.6.3 Channel Current Setting Commands (ISET1 and ISET2)
      7. 6.3.7  Channel Current Monitor (IMON1, IMON2)
        1. 6.3.7.1 Individual Channel Current Monitor
        2. 6.3.7.2 Multiphase Total Current Monitoring
      8. 6.3.8  Cycle-by-Cycle Peak Current Limit (IPK)
      9. 6.3.9  Inner Current Loop Error Amplifier
      10. 6.3.10 Outer Voltage Loop Error Amplifier
      11. 6.3.11 Soft Start, Diode Emulation, and Forced PWM Control (SS/DEM1 and SS/DEM2)
        1. 6.3.11.1 ISET Soft-Start Control by the SS/DEM Pins
        2. 6.3.11.2 DEM Programming
        3. 6.3.11.3 FPWM Programming and Dynamic FPWM and DEM Change
      12. 6.3.12 Gate Drive Outputs, Dead Time Programming and Adaptive Dead Time (HO1, HO2, LO1, LO2, DT/SD)
      13. 6.3.13 Emergency Latched Shutdown (DT/SD)
      14. 6.3.14 PWM Comparator
      15. 6.3.15 Oscillator (OSC)
      16. 6.3.16 Synchronization to an External Clock (SYNCI, SYNCO)
      17. 6.3.17 Overvoltage Protection (OVP)
      18. 6.3.18 Multiphase Configurations (SYNCO, OPT)
        1. 6.3.18.1 Multiphase in Star Configuration
        2. 6.3.18.2 Daisy-Chain Configurations for 2, 3, or 4 Phases parallel operations
        3. 6.3.18.3 Daisy-Chain configuration for 6 or 8 phases parallel operation
      19. 6.3.19 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Initialization Mode
      2. 6.4.2 Standby Mode
      3. 6.4.3 Power Delivery Mode
      4. 6.4.4 Shutdown Mode
      5. 6.4.5 Latched Shutdown mode
  8. 7 Registers
    1. 7.1 I2C Serial Interface
    2. 7.2 I2C Bus Operation
    3. 7.3 Clock Stretching
    4. 7.4 Data Transfer Formats
    5. 7.5 Single READ From a Defined Register Address
    6. 7.6 Sequential READ Starting From a Defined Register Address
    7. 7.7 Single WRITE to a Defined Register Address
    8. 7.8 Sequential WRITE Starting From A Defined Register Address
    9. 7.9 REGFIELD Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Small Signal Model
        1. 8.1.1.1 Current Loop Small Signal Model
        2. 8.1.1.2 Current Loop Compensation
        3. 8.1.1.3 Voltage Loop Small Signal Model
        4. 8.1.1.4 Voltage Loop Compensation
    2. 8.2 PWM to ISET Pins
    3. 8.3 ISET Clamp
    4. 8.4 Dynamic Dead Time Adjustment
    5. 8.5 Proper Termination of Unused Pins
    6. 8.6 Typical Application
      1. 8.6.1 60A, Dual-Phase, 48V to 12V Bidirectional Converter
        1. 8.6.1.1 Design Requirements
        2. 8.6.1.2 Detailed Design Procedure
          1. 8.6.1.2.1  Determining the Duty Cycle
          2. 8.6.1.2.2  Oscillator Programming (OSC)
          3. 8.6.1.2.3  Power Inductor, RMS and Peak Currents
          4. 8.6.1.2.4  Current Sense (RCS)
          5. 8.6.1.2.5  Current Setting Commands (ISETx)
          6. 8.6.1.2.6  Peak Current Limit (IPK)
          7. 8.6.1.2.7  Power MOSFETS
          8. 8.6.1.2.8  Bias Supply
          9. 8.6.1.2.9  Boot Strap Capacitor
          10. 8.6.1.2.10 Overvoltage Protection (OVP)
          11. 8.6.1.2.11 Dead Time (DT/SD)
          12. 8.6.1.2.12 Channel Current Monitor (IMONx)
          13. 8.6.1.2.13 Undervoltage Lockout (UVLO)
          14. 8.6.1.2.14 HVx Pin Configuration
          15. 8.6.1.2.15 Loop Compensation
          16. 8.6.1.2.16 Soft Start (SS/DEMx)
        3. 8.6.1.3 Application Curves
          1. 8.6.1.3.1 Efficiency and Thermal Performance
          2. 8.6.1.3.2 Step Load Response
          3. 8.6.1.3.3 Dual-Channel Interleaving Operation
          4. 8.6.1.3.4 Typical Start Up and Shutdown
          5. 8.6.1.3.5 DEM and FPWM
          6. 8.6.1.3.6 Mode Transition Between DEM and FPWM
          7. 8.6.1.3.7 ISET Tracking and Pre-charge
          8. 8.6.1.3.8 Protections
    7. 8.7 Power Supply Recommendations
    8. 8.8 Layout
      1. 8.8.1 Layout Guidelines
      2. 8.8.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.7.1 Individual Channel Current Monitor

When the IMONx is "Monitoring Inductor Current" as shown in Table 6-2, the IMONx pin source current is determined by,

Equation 7. I I M O N = R C S × I L m × 2 µ A m V + 50 μ A

Where

  • RCS is the current sense resistor of the channel.
  • ILm is the inductor current of the channel.
  • 50µA is the DC offset current superimposed on to the IMON signals.
LM5171-Q1 IMON Current Source vs Current Sense Voltage Figure 6-8 IMON Current Source vs Current Sense Voltage

When the IMONx is configured to monitor boost output current (Refer to Table 6-2), the IMONx pin source current is determined by,

Equation 8. I I M O N _ B S T O U T = R C S × I B S T O U T × 2 µ A m V + 50 μ A

Where

  • IMON_BSTOUT is the boost mode output current of the channel.
LM5171-Q1 IMON Current Source vs Boost Output Current Figure 6-9 IMON Current Source vs Boost Output Current

The 50µA DC offset current is introduced to raise the no-load signal above the possible ground noise floor. Because the monitor signal is in the form of current, an accurate reading is obtained across a termination resistor even if the resistor is located far from the LM5171-Q1 but close to the MCU, thus rejecting potential ground differences between the LM5171-Q1 and the MCU. Figure 6-10 shows a typical channel current monitor through a 20kΩ termination resistor and a 10nF to 100nF ceramic capacitor in parallel. The RC network converts the current monitor signal into a DC voltage proportional to the channel DC current. Note that the maximum active operating voltage of the IMONx pin is 3V.

LM5171-Q1 Channel Current Monitor Figure 6-10 Channel Current Monitor