SNVSCM3 June   2024 LM5171

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1 Device Configurations (CFG) and I2C Address
      2. 6.1.2 Definition of IC Operation Modes
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Bias Supplies and Voltage Reference (VCC, VDD, and VREF)
      2. 6.3.2  Undervoltage Lockout (UVLO) and Controller Enable or Disable
      3. 6.3.3  High Voltage Inputs (HV1, HV2)
      4. 6.3.4  Current Sense Amplifier
      5. 6.3.5  Control Commands
        1. 6.3.5.1 Channel Enable Commands (EN1, EN2)
        2. 6.3.5.2 Direction Command (DIR1 and DIR2)
        3. 6.3.5.3 Channel Current Setting Commands (ISET1 and ISET2)
      6. 6.3.6  Channel Current Monitor (IMON1, IMON2)
        1. 6.3.6.1 Individual Channel Current Monitor
        2. 6.3.6.2 Multiphase Total Current Monitoring
      7. 6.3.7  Cycle-by-Cycle Peak Current Limit (IPK)
      8. 6.3.8  Inner Current Loop Error Amplifier
      9. 6.3.9  Outer Voltage Loop Error Amplifier
      10. 6.3.10 Soft Start, Diode Emulation, and Forced PWM Control (SS/DEM1 and SS/DEM2)
        1. 6.3.10.1 Soft-Start Control by the SS/DEM Pins
        2. 6.3.10.2 DEM Programming
        3. 6.3.10.3 FPWM Programming and Dynamic FPWM and DEM Change
        4. 6.3.10.4 SS Pin as the Restart Timer
          1. 6.3.10.4.1 Restart Timer in OVP
          2. 6.3.10.4.2 Restart Timer after a DIR Change
      11. 6.3.11 Gate Drive Outputs, Dead Time Programming and Adaptive Dead Time (HO1, HO2, LO1, LO2, DT/SD)
      12. 6.3.12 Emergency Latched Shutdown (DT/SD)
      13. 6.3.13 PWM Comparator
      14. 6.3.14 Oscillator (OSC)
      15. 6.3.15 Synchronization to an External Clock (SYNCI, SYNCO)
      16. 6.3.16 Overvoltage Protection (OVP)
      17. 6.3.17 Multiphase Configurations (SYNCO, OPT)
        1. 6.3.17.1 Multiphase in Star Configuration
        2. 6.3.17.2 Daisy-Chain Configurations for 2, 3, or 4 Phases parallel operations
        3. 6.3.17.3 Daisy-Chain configuration for 6 or 8 phases parallel operation
      18. 6.3.18 Thermal Shutdown
    4. 6.4 Programming
      1. 6.4.1 Dynamic Dead Time Adjustment
      2. 6.4.2 UVLO Programming
    5. 6.5 Registers
      1. 6.5.1 I2C Serial Interface
      2. 6.5.2 I2C Bus Operation
      3. 6.5.3 Clock Stretching
      4. 6.5.4 Data Transfer Formats
      5. 6.5.5 Single READ From a Defined Register Address
      6. 6.5.6 Sequential READ Starting From a Defined Register Address
      7. 6.5.7 Single WRITE to a Defined Register Address
      8. 6.5.8 Sequential WRITE Starting From A Defined Register Address
      9. 6.5.9 REGFIELD Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Small Signal Model
        1. 7.1.1.1 Current Loop Small Signal Model
        2. 7.1.1.2 Current Loop Compensation
        3. 7.1.1.3 Voltage Loop Small Signal Model
        4. 7.1.1.4 Voltage Loop Compensation
    2. 7.2 Typical Application
      1. 7.2.1 60A, Dual-Phase, 48V to 12V Bidirectional Converter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1  Determining the Duty Cycle
          2. 7.2.1.2.2  Oscillator Programming
          3. 7.2.1.2.3  Power Inductor, RMS and Peak Currents
          4. 7.2.1.2.4  Current Sense (RCS)
          5. 7.2.1.2.5  Current Setting Limits (ISETx)
          6. 7.2.1.2.6  Peak Current Limit
          7. 7.2.1.2.7  Power MOSFETS
          8. 7.2.1.2.8  Bias Supply
          9. 7.2.1.2.9  Boot Strap
          10. 7.2.1.2.10 OVP
          11. 7.2.1.2.11 Dead Time
          12. 7.2.1.2.12 Channel Current Monitor (IMONx)
          13. 7.2.1.2.13 UVLO Pin Usage
          14. 7.2.1.2.14 HVx Pin Configuration
          15. 7.2.1.2.15 Loop Compensation
          16. 7.2.1.2.16 Soft Start
          17. 7.2.1.2.17 PWM to ISET Pins
          18. 7.2.1.2.18 Proper Termination of Unused Pins
        3. 7.2.1.3 Application Curves
          1. 7.2.1.3.1 Efficiency
          2. 7.2.1.3.2 Step Load Response
          3. 7.2.1.3.3 Dual-Channel Interleaving Operation
          4. 7.2.1.3.4 Typical Start Up and Shutdown
          5. 7.2.1.3.5 DEM and FPWM
          6. 7.2.1.3.6 Mode transition between DEM and FPWM
          7. 7.2.1.3.7 ISET Tracking and PreCharge
          8. 7.2.1.3.8 Protections
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.6.1 Individual Channel Current Monitor

The monitors are set to monitor the inductor current in power path. With R-C filter on IMON1 or IMON2 average inductor current can be monitored, which in boost mode can be set to Load current based on CFG setting and in Buck mode is the Load current irrespective of CFG setting. The monitor current source is determined by Equation 6 and Equation 7:

Equation 6. IMON1=  VCS1500 +50 uA
Equation 7. IMON2 =VCS2500+50μA

Where

  • VCS1 and VCS2 are the real time current sense voltage of CH-1 and CH-2, respectively.
  • the 50 µA is a DC offset current superimposed on to the IMON signals (refer to Figure 6-5).
LM5171 IMON Current Source vs Current Sense VoltageFigure 6-5 IMON Current Source vs Current Sense Voltage

The 50-µA DC offset current is introduced to raise the no-load signal above the possible ground noise floor. Because the monitor signal is in the form of current, an accurate reading can be obtained across a termination resistor even if the resistor is located far from the LM5171 but close to the MCU, thus rejecting potential ground differences between the LM5171 and the MCU. Figure 6-7 shows a typical channel current monitor through a 20-KΩ termination resistor and a 10-nF to 100-nF ceramic capacitor in parallel. The RC network converts the current monitor signal into a DC voltage proportional to the channel DC current. For example, when the current sense voltage DC component is 50 mVdc, namely VCS_dc = 50 mV, the termination RC network produces a DC voltage of 3 V. Note that the maximum active operating voltage of the IMON pin is 3 V.

When the monitors are set to monitor the output DC current, which is the channel load current flowing out of the LV-port in the buck mode, or flowing out of the HV-port in the boost mode, the monitor current source is determined by Equation 8 through Equation 11:

Equation 8. IMON1BK =RCS1×IO1_BK500+50μA
Equation 9. IMON2BK=RCS2×IO2_BK500+50μA
Equation 10. IMON1BST =RCS1×IO1_BST500+50μA
Equation 11. IMON2BST=RCS2×IO2_BST500+50μA

Where

  • IO1_BK and IO2_BK are the buck mode inductor current of CH-1 and CH-2, respectively.

  • IO1_BST and IO2_BST are the boost mode output current of CH-1 and CH-2, respectively.

  • RCS1 and RCS2 are current sense resistor in power path.

Obviously, the buck mode channel load current is the same as shown in Figure 6-5. However, the boost load current can be shown as in Figure 6-6.

LM5171 IMON Current Source vs Boost Load CurrentFigure 6-6 IMON Current Source vs Boost Load Current
LM5171 Channel Current MonitorFigure 6-7 Channel Current Monitor