SNVSCL2 December   2024 LM51770

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Gate Driver Rise Time and Fall Time
    2. 7.2 Gate Driver Dead (Transition) Time
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power-On Reset (POR System)
      2. 8.3.2  Buck-Boost Control Scheme
        1. 8.3.2.1 Boost Mode
        2. 8.3.2.2 Buck Mode
        3. 8.3.2.3 Buck-Boost Mode
      3. 8.3.3  Power Save Mode
      4. 8.3.4  Supply Voltage Selection – VMAX Switch
      5. 8.3.5  Enable and Undervoltage Lockout
      6. 8.3.6  Oscillator Frequency Selection
      7. 8.3.7  Frequency Synchronization
      8. 8.3.8  Voltage Regulation Loop
      9. 8.3.9  Output Voltage Tracking
      10. 8.3.10 Slope Compensation
      11. 8.3.11 Configurable Soft Start
      12. 8.3.12 Peak Current Sensor
      13. 8.3.13 Current Monitoring and Current Limit Control Loop
      14. 8.3.14 Short Circuit - Hiccup Protection
      15. 8.3.15 nFLT Pin and Protections
      16. 8.3.16 Device Configuration Pin
      17. 8.3.17 Dual Random Spread Spectrum – DRSS
      18. 8.3.18 Gate Driver
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Detailed Design Procedure
        1. 9.2.1.1  Custom Design with WEBENCH Tools
        2. 9.2.1.2  Frequency
        3. 9.2.1.3  Feedback Divider
        4. 9.2.1.4  Inductor and Current Sense Resistor Selection
        5. 9.2.1.5  Slope Compensation
        6. 9.2.1.6  Output Capacitor
        7. 9.2.1.7  Input Capacitor
        8. 9.2.1.8  UVLO Divider
        9. 9.2.1.9  Soft-Start Capacitor
        10. 9.2.1.10 MOSFETs QH1 and QL1
        11. 9.2.1.11 MOSFETs QH2 and QL2
        12. 9.2.1.12 Frequency Compensation
        13. 9.2.1.13 External Component Selection
      2. 9.2.2 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Stage Layout
      2. 11.1.2 Gate Driver Layout
      3. 11.1.3 Controller Layout
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design with WEBENCH Tools
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information
    1.     80

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM51770 UNIT
HTSSOP
38 PINS
RθJA Junction-to-ambient thermal resistance 33.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 18.4 °C/W
RθJB Junction-to-board thermal resistance 15.2 °C/W
ψJT Junction-to-top characterization parameter 0.5 °C/W
ψJB Junction-to-board characterization parameter 15 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.