SNVSBM6A April   2020  – January 2021 LM5181

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Integrated Power MOSFET
      2. 8.3.2  PSR Flyback Modes of Operation
      3. 8.3.3  Setting the Output Voltage
        1. 8.3.3.1 Diode Thermal Compensation
      4. 8.3.4  Control Loop Error Amplifier
      5. 8.3.5  Precision Enable
      6. 8.3.6  Configurable Soft Start
      7. 8.3.7  External Bias Supply
      8. 8.3.8  Minimum On-Time and Off-Time
      9. 8.3.9  Overcurrent Protection
      10. 8.3.10 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1: Wide VIN, Low IQ PSR Flyback Converter Rated at 5 V, 0.5 A
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2  Custom Design With Excel Quickstart Tool
          3. 9.2.1.2.3  Flyback Transformer – T1
          4. 9.2.1.2.4  Flyback Diode – DFLY
          5. 9.2.1.2.5  Zener Clamp Circuit – DF, DCLAMP
          6. 9.2.1.2.6  Output Capacitor – COUT
          7. 9.2.1.2.7  Input Capacitor – CIN
          8. 9.2.1.2.8  Feedback Resistor – RFB
          9. 9.2.1.2.9  Thermal Compensation Resistor – RTC
          10. 9.2.1.2.10 UVLO Resistors – RUV1, RUV2
          11. 9.2.1.2.11 Soft-Start Capacitor – CSS
      2. 9.2.2 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.6 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.