SNVSCG7 November   2024 LM5190

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Input Voltage Range (VIN)
      2. 6.3.2  High-Voltage Bias Supply Regulator (VCC, BIAS)
      3. 6.3.3  Precision Enable (EN)
      4. 6.3.4  Power-Good Monitor (PGOOD)
      5. 6.3.5  Switching Frequency (RT)
      6. 6.3.6  Low Dropout Mode
      7. 6.3.7  Dual Random Spread Spectrum (DRSS)
      8. 6.3.8  Soft Start
      9. 6.3.9  Output Voltage Setpoint (FB)
      10. 6.3.10 Minimum Controllable On Time
      11. 6.3.11 Inductor Current Sense (ISNS+, VOUT)
      12. 6.3.12 Voltage Loop Error Amplifier
      13. 6.3.13 Current Monitor, Programmable Current Limit, and Current Loop Error Amplifier (IMON/ILIM, ISET)
      14. 6.3.14 Dual Loop Architecture
      15. 6.3.15 PWM Comparator
      16. 6.3.16 Slope Compensation
      17. 6.3.17 Hiccup Mode Current Limiting
      18. 6.3.18 High-Side and Low-Side Gate Drivers (HO, LO)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode
      2. 6.4.2 Forced PWM Mode and Synchronization (FPWM/SYNC)
      3. 6.4.3 Thermal Shutdown
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power Train Components
        1. 7.1.1.1 Buck Inductor
        2. 7.1.1.2 Output Capacitors
        3. 7.1.1.3 Input Capacitors
        4. 7.1.1.4 Power MOSFETs
        5. 7.1.1.5 EMI Filter
      2. 7.1.2 Error Amplifier and Compensation
    2. 7.2 Typical Applications
      1. 7.2.1 High Efficiency 400kHz CC-CV Regulator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Buck Inductor
          2. 7.2.1.2.2 Current-Sense Resistance
          3. 7.2.1.2.3 Output Capacitors
          4. 7.2.1.2.4 Input Capacitors
          5. 7.2.1.2.5 Frequency Set Resistor
          6. 7.2.1.2.6 Feedback Resistors
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Power Stage Layout
        2. 7.4.1.2 Gate-Drive Layout
        3. 7.4.1.3 PWM Controller Layout
        4. 7.4.1.4 Thermal Design and Layout
        5. 7.4.1.5 Ground Plane Design
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
        1. 8.2.1.1 PCB Layout Resources
        2. 8.2.1.2 Thermal Design Resources
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
Input Capacitors

A power supply input typically has a relatively high source impedance at the switching frequency. Good-quality input capacitors are necessary to limit the input ripple voltage. As mentioned earlier, dual-channel interleaved operation significantly reduces the input ripple amplitude. In general, the ripple current splits between the input capacitors based on the relative impedance of the capacitors at the switching frequency.

  1. Select the input capacitors with sufficient voltage and RMS ripple current ratings.
  2. Use Equation 47 to calculate the input capacitor RMS ripple current assuming a worst-case duty-cycle operating point of 50%.
    Equation 47. I C I N , r m s = D × I L O A D 2 × 1 - D + I L O U T 2 12 = 0.5 × 8 2 × 1 - 0.5 + 3.676 2 12 = 4.1 A
  3. Use Equation 48 to find the required input capacitance.
    Equation 48. C I N D × 1 - D × I L O A D f S W × V S U P P L Y - I L O A D × R E S R = 0.5 × 1 - 0.5 × 8 400 k × 0.25 - 8 × 1 m = 21 μ F

    where

    • ΔVSUPPLY is the input peak-to-peak ripple voltage specification.
    • RESR is the input capacitor ESR.
  4. Recognizing the voltage coefficient of ceramic capacitors, select six 4.7µF, 100V, X7R, 1210 ceramic input capacitors. Place these capacitors adjacent to the power MOSFETs. See Section 7.4.1.1 for more details.
  5. Use six 10nF, 100V, X7R, 0603 ceramic capacitors near the high-side MOSFET to supply the high di/dt current during MOSFET switching transitions. Such capacitors offer high self-resonant frequency (SRF) and low effective impedance above 100MHz. The result is lower power loop parasitic inductance, thus minimizing switch-node voltage overshoot and ringing for lower conducted and radiated EMI signature. Refer to Section 7.4.1 for more details.