SNOSB23F October   2008  – July 2019 LM5575-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Shutdown and Standby
      2. 7.3.2 Current Limit
      3. 7.3.3 Soft Start
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 High-Voltage Start-Up Regulator
      2. 7.4.2 Oscillator and Sync Capability
      3. 7.4.3 Error Amplifier and PWM Comparator
      4. 7.4.4 Ramp Generator
      5. 7.4.5 BOOST Pin
      6. 7.4.6 Maximum Duty Cycle and Input Dropout Voltage
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bias Power Dissipation Reduction
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  External Components
        3. 8.2.2.3  R3 (RT)
        4. 8.2.2.4  L1
        5. 8.2.2.5  C3 (CRAMP)
        6. 8.2.2.6  C9, C10
        7. 8.2.2.7  D1
        8. 8.2.2.8  C1, C2
        9. 8.2.2.9  C8
        10. 8.2.2.10 C7
        11. 8.2.2.11 C4
        12. 8.2.2.12 R5, R6
        13. 8.2.2.13 R1, R2, C12
        14. 8.2.2.14 R7, C11
        15. 8.2.2.15 R4, C5, C6
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (February 2019) to F Revision

  • Added Grade 0 information to Features Go
  • Added Grade 1 and Grade 0 sentence to end of Description Go

Changes from D Revision (March 2018) to E Revision

  • Removed references to the LM2xxx devices from the data sheet Go
  • Changed "760" mΩ to "800 mΩ" in buck switch Rds(on) over full operating junction temperature rowGo
  • Changed forced off-time maximum value from: 590 ns to: 626 ns in full operating junction temperature rangeGo

Changes from C Revision (December 2014) to D Revision

  • Added links for WEBENCH; minor editorial updates for SEO improvementGo
  • Changed RθJA from "50°C/W" to "38.4°C/W" Go
  • Changed RθJC(top) from "14°C/W" to "21.8°C/W"; add additional thermal values Go
  • Corrected unit for RL to "kΩ"Go

Changes from B Revision (April 2013) to C Revision

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from A Revision (April 2013) to B Revision

  • Changed layout of National Semiconductor data sheet to TI formatGo