SNOSB23F October   2008  – July 2019 LM5575-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Shutdown and Standby
      2. 7.3.2 Current Limit
      3. 7.3.3 Soft Start
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 High-Voltage Start-Up Regulator
      2. 7.4.2 Oscillator and Sync Capability
      3. 7.4.3 Error Amplifier and PWM Comparator
      4. 7.4.4 Ramp Generator
      5. 7.4.5 BOOST Pin
      6. 7.4.6 Maximum Duty Cycle and Input Dropout Voltage
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bias Power Dissipation Reduction
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  External Components
        3. 8.2.2.3  R3 (RT)
        4. 8.2.2.4  L1
        5. 8.2.2.5  C3 (CRAMP)
        6. 8.2.2.6  C9, C10
        7. 8.2.2.7  D1
        8. 8.2.2.8  C1, C2
        9. 8.2.2.9  C8
        10. 8.2.2.10 C7
        11. 8.2.2.11 C4
        12. 8.2.2.12 R5, R6
        13. 8.2.2.13 R1, R2, C12
        14. 8.2.2.14 R7, C11
        15. 8.2.2.15 R4, C5, C6
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM5575-Q1 UNIT
PWP (HTSSOP)
16 PINS
RθJA Junction-to-ambient thermal resistance 38.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.8 °C/W
RθJB Junction-to-board thermal resistance 15.6 °C/W
ψJT Junction-to-top characterization parameter 0.5 °C/W
ψJB Junction-to-board characterization parameter 16.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.