SNVS447J January   2007  – November 2014 LM5576 , LM5576-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings: LM5576
    3. 6.3 Handling Ratings: LM5576-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Shutdown / Standby
      2. 7.3.2 Soft-Start
      3. 7.3.3 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 High Voltage Start-Up Regulator
      2. 7.4.2 Oscillator and Sync Capability
      3. 7.4.3 Error Amplifier and PWM Comparator
      4. 7.4.4 Ramp Generator
      5. 7.4.5 Maximum Duty Cycle / Input Drop-Out Voltage
      6. 7.4.6 Boost Pin
      7. 7.4.7 Current Limit
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bias Power Dissipation Reduction
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  External Components
        2. 8.2.2.2  R3 (RT)
        3. 8.2.2.3  L1
        4. 8.2.2.4  C3 (CRAMP)
        5. 8.2.2.5  C9, C10
        6. 8.2.2.6  D1
        7. 8.2.2.7  C1, C2
        8. 8.2.2.8  C8
        9. 8.2.2.9  C7
        10. 8.2.2.10 C4
        11. 8.2.2.11 R5, R6
        12. 8.2.2.12 R1, R2, C12
        13. 8.2.2.13 R7, C11
        14. 8.2.2.14 R4, C5, C6
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from I Revision (April 2013) to J Revision

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from H Revision (April 2013) to I Revision

  • Changed layout of National Data Sheet to TI formatGo