SNIS119F May   2004  – August 2017 LM60

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LM60 Transfer Function
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Capacitive Loads
    2. 9.2 Typical Applications
      1. 9.2.1 Full-Range Centigrade Temperature Sensor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Centigrade Thermostat Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 Conserving Power Dissipation With Shutdown
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage −0.2 12 V
Output voltage −0.6 VS + 0.6 V
Output current 10 mA
Input current at any pin(2) 5 mA
Maximum junction temperature (TJMAX) 125 °C
Storage temperature (Tstg) −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > +VS), the current at that pin should be limited to 5 mA.

7.2 ESD Ratings

VALUE UNIT
LM60 in DBZ Package
V(ESD) Electrostatic discharge(1) Human-body model (HBM) ±2500 V
Machine model (MM) ±250
LM60 in LP Package
V(ESD) Electrostatic discharge(1) Human-body model (HBM) ±2500 V
Machine model (MM) ±200
(1) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
LM60B (TMIN ≤ TA ≤ TMAX) –25(2) 125 °C
LM60C (TMIN ≤ TA ≤ TMAX) –40 125 °C
Supply voltage (+VS) 2.7 10 V
(1) Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to www.national.com/packaging. Reflow temperature profiles are different for lead-free and non-lead-free packages.
(2) LM60B will operate down to –40°C without damage but the accuracy is only ensured from –25°C to 125°C.

7.4 Thermal Information

THERMAL METRIC(1) LM60 UNIT
DBZ (SOT-23) LP (TO-92)
3 PINS 3 PINS
RθJA(2)   Junction-to-ambient thermal resistance 266 162 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 135 85 °C/W
RθJB Junction-to-board thermal resistance 59 — °C/W
ψJT Junction-to-top characterization parameter 18 29 °C/W
ψJB Junction-to-board characterization parameter 58 142 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor or IC Package Thermal Metrics application report.
(2) The junction to ambient thermal resistance (RθJA) is specified without a heat sink in still air.

7.5 Electrical Characteristics

Unless otherwise noted, these specifications apply for +VS = 3 VDC and ILOAD = 1 μA. All limits TA = TJ = 25°C unless otherwise noted.
PARAMETER TEST CONDITIONS MIN(2) TYP(1) MAX(2) UNIT
Accuracy(3) LM60B –2 2 °C
TA = TJ = TMIN to TMAX –3 3
LM60C –3 3 °C
TA = TJ = TMIN to TMAX –4 4
Output voltage at 0°C 424 mV
Nonlinearity(4) LM60B TA = TJ = TMIN to TMAX –0.6 ±0.6 °C
LM60C TA = TJ = TMIN to TMAX –0.8 ±0.8
Sensor gain (average slope) 6.25 mV/°C
LM60B TA = TJ = TMIN to TMAX 6.06 6.44
LM60C TA = TJ = TMIN to TMAX 6 6.5
Output impedance TA = TJ = TMIN to TMAX 800 Ω
Line regulation(5) 3 V ≤ +VS ≤ 10 V TA = TJ = TMIN to TMAX –0.3 0.3 mV/V
2.7 V ≤ +VS ≤ 3.3 V TA = TJ = TMIN to TMAX –2.3 2.3 mV
Quiescent current 2.7 V ≤ +VS ≤ 10 V 82 110 μA
TA = TJ = TMIN to TMAX 125 μA
Change of quiescent current 2.7 V ≤ +VS ≤ 10 V ±5 μA
Temperature coefficient of quiescent current 0.2 μA/°C
Long-term stability(6) TJ = TMAX = 125°C
for 1000 hours		 ±0.2 °C
(1) Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
(2) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
(3) Accuracy is defined as the error between the output voltage and 6.25 mV/°C times the case temperature of the device plus 424 mV, at specified conditions of voltage, current, and temperature (expressed in °C).
(4) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated temperature range of the device.
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance.
(6) For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, temperature cycled for at least 46 hours before long-term life test begins for both temperatures. This is especially true when a small (surface-mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate.

7.6 Typical Characteristics

To generate these curves, the device was mounted to a printed-circuit board as shown in Figure 20.
LM60 sva1268103_nis119.gif Figure 1. Thermal Resistance Junction to Air
LM60 sva1268105_nis119.gif Figure 3. Thermal Response in Still Air With Heat Sink
LM60 sva1268108_nis119.gif Figure 5. Thermal Response in Still Air Without a Heat Sink
LM60 sva1268109_nis119.gif Figure 7. Quiescent Current vs Temperature
LM60 sva1268111_nis119.gif Figure 9. Noise Voltage
LM60 sva1268122_nis119.gif Figure 11. Start-Up Response
LM60 sva1268104_nis119.gif Figure 2. Thermal Time Constant
LM60 sva1268106_nis119.gif Figure 4. Thermal Response in Stirred Oil Bath With Heat Sink
LM60 sva1268107_nis119.gif Figure 6. Start-Up Voltage vs Temperature
LM60 sva1268110_nis119.gif Figure 8. Accuracy vs Temperature
LM60 sva1268112_nis119.gif
Figure 10. Supply Voltage vs Supply Current