SNOS792E May   1999  – December 2024 LM6172

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics ±15V
    6. 5.6 Electrical Characteristics ±5V
    7. 5.7 Typical Characteristics: D (SOIC, 8) Package
    8. 5.8 Typical Characteristics: P (PDIP, 8) Package
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Slew Rate
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Circuit Operation
      2. 7.1.2 Reduce Settling Time
      3. 7.1.3 Drive Capacitive Loads
      4. 7.1.4 Compensation for Input Capacitance
      5. 7.1.5 Termination
    2. 7.2 Typical Application
      1. 7.2.1 Application Circuits
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Bypassing
      2. 7.3.2 Power Dissipation
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Printed Circuit Boards and High-Speed Op Amps
        2. 7.4.1.2 Using Probes
        3. 7.4.1.3 Components Selection and Feedback Resistor
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision D (March 2013) to Revision E (December 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added Package Information table and Pin Configuration and Functions, Specifications, ESD Ratings, Recommended Operating Conditions, Thermal Information, Detailed Description, Overview, Functional Block Diagram, Feature Description, Device Functional Modes, Application and Implementation, Typical Applications, Power Supply Recommendations, Layout, Layout Guidelines, Layout Example, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Changed pin names and updated pinout diagram to reflect new naming conventionGo
  • Updated Thermal Information for the D (SOIC-8) and P (PDIP-8) packages.Go
  • Moved DC and AC Electrical Characteristics into one table for both ±15V and ±5V specifications.Go
  • Changed output short-circuit current for D package.Go
  • Updated unity-gain bandwidth from 100MHz to 80MHz for D package.Go
  • Updated second harmonic distortion for D package.Go
  • Updated third harmonic distortion for D package.Go
  • Changed output short-circuit current for D package.Go
  • Updated –3dB frequency for D package.Go
  • Updated phase margin for D package.Go
  • Updated second harmonic distortion for D package.Go
  • Updated third harmonic distortion for D package.Go
  • Deleted Maximum Power Dissipation vs Ambient Temperature Go
  • Changed thermal values in Power Dissipation to match Thermal Information tableGo

Changes from Revision C (March 2013) to Revision D (March 2013)

  • Deleted ESD information and footnote from Absolute Maximum Ratings and moved to ESD Ratings.Go
  • Deleted footnote from Recommended Operating Conditions.Go
  • Changed layout of National Data Sheet to TI formatGo