SNOS792E May   1999  – December 2024 LM6172

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics ±15V
    6. 5.6 Electrical Characteristics ±5V
    7. 5.7 Typical Characteristics: D (SOIC, 8) Package
    8. 5.8 Typical Characteristics: P (PDIP, 8) Package
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Slew Rate
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Circuit Operation
      2. 7.1.2 Reduce Settling Time
      3. 7.1.3 Drive Capacitive Loads
      4. 7.1.4 Compensation for Input Capacitance
      5. 7.1.5 Termination
    2. 7.2 Typical Application
      1. 7.2.1 Application Circuits
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Bypassing
      2. 7.3.2 Power Dissipation
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Printed Circuit Boards and High-Speed Op Amps
        2. 7.4.1.2 Using Probes
        3. 7.4.1.3 Components Selection and Feedback Resistor
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VS Supply voltage (VCC+ – VCC–) 36 V
VI Differential input voltage ±10 V
VCM Common-mode voltage VCC– – 0.3 VCC+ + 0.3 V
IIN Input current ±10 mA
ISC Output current short to ground(3) Continuous A
TJ Junction temperature(4) 150 ℃
Tstg Storage temperature –65 150 ℃
TSOLDER Infrared or convection reflow (20 seconds) 235 ℃
Wave soldering lead temp (10 seconds) 260
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(2) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C.
(4) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly into a PC board.