SNVSB55H February   2019  – June 2024 LM63615-Q1 , LM63625-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1.     Absolute Maximum Ratings
    2. 6.1 ESD Ratings
    3. 6.2 Recommended Operating Conditions
    4. 6.3 Thermal Information
    5. 6.4 Electrical Characteristics
    6. 6.5 Timing Characteristics
    7. 6.6 Switching Characteristics
    8. 6.7 System Characteristics
    9. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sync/Mode Selection
      2. 7.3.2 Output Voltage Selection
      3. 7.3.3 Switching Frequency Selection
        1. 7.3.3.1 Spread Spectrum Option
      4. 7.3.4 Enable and Start-Up
      5. 7.3.5 RESET Flag Output
      6. 7.3.6 Undervoltage Lockout and Thermal Shutdown and Output Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Overview
      2. 7.4.2 Light Load Operation
        1. 7.4.2.1 Sync/FPWM Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Minimum On-time Operation
      5. 7.4.5 Current Limit and Short-Circuit Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Choosing the Switching Frequency
        2. 8.2.2.2 Setting the Output Voltage
          1. 8.2.2.2.1 CFF Selection
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 CBOOT
        7. 8.2.2.7 VCC
        8. 8.2.2.8 External UVLO
        9. 8.2.2.9 Maximum Ambient Temperature
      3. 8.2.3 Full Feature Design Example
      4. 8.2.4 Application Curves
      5. 8.2.5 EMI Performance Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 Typical Application

Figure 8-1 shows a typical application circuit for the LM636x5D-Q1. This device is designed to function over a wide range of external components and system parameters. However, the internal compensation is optimized for a certain range of external inductance and output capacitance. As a quick start guide, see Table 8-1 and
Table 8-2 for typical component values.

LM63615-Q1 LM63625-Q1 Example Application Circuit VIN = 12 V, VOUT = 5 V, IOUT = 2.5 A, ƒSW = 2.1 MHzFigure 8-1 Example Application Circuit VIN = 12 V, VOUT = 5 V, IOUT = 2.5 A, ƒSW = 2.1 MHz
Table 8-1 Typical External Component Values for 1.5-A Output Current
ƒSW (kHz)VOUTL (µH)(1)TYPICAL(2) COUTMINIMUM(2) COUTVSELRTCINCBOOTCVCC
4003.3104 × 10 µF2 × 10 µFAGNDVCC4.7 µF + 220 nF220 nF1 µF
21003.34.72 × 10 µF1 × 10 µFAGNDAGND4.7 µF + 220 nF220 nF1 µF
4005104 × 10 µF2 × 10 µFVCCVCC4.7 µF + 220 nF220 nF1 µF
210054.72 × 10 µF1 × 10 µFVCCAGND4.7 µF + 220 nF220 nF1 µF
Table 8-2 Typical External Component Values for 2.5-A Output Current
ƒSW (kHz)VOUTL (µH)(1)TYPICAL(2) COUTMINIMUM(2) COUTVSELRTCINCBOOTCVCC
4003.36.83 × 22 µF2 × 22 µFAGNDVCC4.7 µF + 220 nF220 nF1 µF
21003.32.22 × 22 µF1 × 22 µFAGNDAGND4.7 µF + 220 nF220 nF1 µF
40056.83 × 22 µF2 × 22 µFVCCVCC4.7 µF + 220 nF220 nF1 µF
210052.22 × 22 µF1 × 22 µFVCCAGND4.7 µF + 220 nF220 nF1 µF
(1) See the Section 8.2.2.3.
(2) See the Section 8.2.2.4.