SNVSCO0 January   2024 LM63635C-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 System Characteristics
    9. 6.9 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Selection
      2. 7.3.2 Switching Frequency Selection
        1. 7.3.2.1 Spread Spectrum Option
      3. 7.3.3 Enable and Start-Up
      4. 7.3.4 RESET Flag Output
      5. 7.3.5 Undervoltage Lockout, Thermal Shutdown, and Output Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Overview
      2. 7.4.2 Light Load Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Minimum On-Time Operation
      5. 7.4.5 Current Limit and Short-Circuit Operation
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Choosing the Switching Frequency
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 CBOOT
        6. 8.2.2.6 VCC
        7. 8.2.2.7 External UVLO
        8. 8.2.2.8 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
      4. 8.2.4 EMI Performance Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Glossary
    7. 9.7 Electrostatic Discharge Caution
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

EMI Performance Curves

EMI results critically depend on PCB layout and test setup. The results given here are typical and given for information purposes only. Figure 8-18 shows the used EMI filter. The limit lines shown refer to CISPR25 class 5.

GUID-98F06241-C0AB-4913-B9B1-EEAE84AD4DB6-low.gif
VOUT = 5VƒSW = 400kHz
DitherIOUT = 3.25 A
Figure 8-16 Typical Conducted EMI 0.15MHz to 30MHz
GUID-716EA608-D479-4957-8AA8-2C37553FE5F6-low.gif
VOUT = 5VƒSW = 400kHz
DitherIOUT = 3.25A
Figure 8-17 Typical Conducted EMI 30MHz to 108MHz
GUID-20240105-SS0I-KJRD-PJBG-BRK2KB29DRVZ-low.svg
Input filter used only for EMI measurements shown in Section 8.2.4.
Figure 8-18 Typical Input EMI Filter