SNVSCO0 January   2024 LM63635C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 System Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Selection
      2. 7.3.2 Switching Frequency Selection
        1. 7.3.2.1 Spread Spectrum Option
      3. 7.3.3 Enable and Start-Up
      4. 7.3.4 RESET Flag Output
      5. 7.3.5 Undervoltage Lockout, Thermal Shutdown, and Output Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Overview
      2. 7.4.2 Light Load Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Minimum On-Time Operation
      5. 7.4.5 Current Limit and Short-Circuit Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Choosing the Switching Frequency
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 CBOOT
        6. 8.2.2.6 VCC
        7. 8.2.2.7 External UVLO
        8. 8.2.2.8 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
      4. 8.2.4 EMI Performance Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Glossary
    7. 9.7 Electrostatic Discharge Caution
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20231110-SS0I-PN7B-2QLF-W07QM5F3Z2HK-low.svg Figure 5-1 DRR Package, 12-Pin WSON With PowerPAD™ Integrated Circuit Package— LM63635C-Q1 (Top View)
Table 5-1 Pin Functions
PIN DESCRIPTION
NAME WSON LM63635C TYPE
SW 1 P Regulator switch node. Connect to power inductor.
CBOOT 2 P Bootstrap supply voltage for internal high-side driver. Connect a high-quality, 220nF capacitor from this pin to the SW pin.
NC 3 — No internal connection to device
VCC 4 A Internal 5V LDO output. Used as supply to internal control circuits. Do not connect to external loads. Can be used as logic supply for regulator functions. Connect a high-quality, 1µF capacitor from this pin to PGND.
MODE 5 A MODE PIN must be tied to AGND
RESET 6 A Open-drain power-good flag output. Connect to a voltage supply that can be used through a current limiting resistor. High = power OK, low = power bad. Flag pulls low when EN = Low. Can be open when not used.
FB 7 A Feedback input to regulator. Connect to output capacitor. Do not float; do not ground.
NC 8 — No internal connection to device
AGND 9 G Analog ground for regulator and system. Ground reference for internal references and logic. All electrical parameters are measured with respect to this pin. Connect to system ground on PCB.
EN 10 A Enable input to regulator. High = ON, Low = OFF. Can be connected directly to VIN. Do not float.
NC 11 — No internal connection to device
VIN 12 P Input supply to regulator. Connect a high-quality bypass capacitors directly to this pin and PGND.
PGND 13 G Power ground terminal. Connect to system ground and AGND. Connect to bypass capacitor with short wide traces.
DAP — G Electrical ground and heat sink connection. Solder directly to system ground plane.
A = Analog, P = Power, G = Ground