SNVSCO0 January   2024 LM63635C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 System Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Selection
      2. 7.3.2 Switching Frequency Selection
        1. 7.3.2.1 Spread Spectrum Option
      3. 7.3.3 Enable and Start-Up
      4. 7.3.4 RESET Flag Output
      5. 7.3.5 Undervoltage Lockout, Thermal Shutdown, and Output Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Overview
      2. 7.4.2 Light Load Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Minimum On-Time Operation
      5. 7.4.5 Current Limit and Short-Circuit Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Choosing the Switching Frequency
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 CBOOT
        6. 8.2.2.6 VCC
        7. 8.2.2.7 External UVLO
        8. 8.2.2.8 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
      4. 8.2.4 EMI Performance Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Glossary
    7. 9.7 Electrostatic Discharge Caution
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

Over the recommended junction temperature range (1)
PARAMETER MIN MAX UNIT
VIN to PGND –0.3 42 V
EN to AGND  –0.3 42 V
RESET to AGND –0.3 16 V
FB to AGND (Fixed VOUT mode) –0.3 16 V
AGND to PGND –0.3 0.3 V
SW to PGND for transients of less than 10ns –6 42 V
BOOT to SW –0.3 5.5 V
VCC to AGND –0.3 5.5 V
TJ Junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.