SNVSCW3 November   2024 LM644A2-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1. 5.1 Wettable Flanks
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range (VIN)
      2. 7.3.2  Enable EN Pin and Use as VIN UVLO
      3. 7.3.3  Output Voltage Selection and Soft Start
      4. 7.3.4  SYNC Allows Clock Synchronization and Mode Selection
      5. 7.3.5  Clock Locking
      6. 7.3.6  Adjustable Switching Frequency
      7. 7.3.7  Power-Good Output Voltage Monitoring
      8. 7.3.8  Internal LDO, VCC UVLO, and BIAS Input
      9. 7.3.9  Bootstrap Voltage and VCBOOT-UVLO (CB1 and CB2 Pin)
      10. 7.3.10 CONFIG Device Configuration Pin
      11. 7.3.11 Spread Spectrum
      12. 7.3.12 Soft Start and Recovery From Dropout
      13. 7.3.13 Overcurrent and Short-Circuit Protection
      14. 7.3.14 Hiccup
      15. 7.3.15 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 Peak Current Mode Operation
        2. 7.4.3.2 Auto Mode Operation
          1. 7.4.3.2.1 Diode Emulation
        3. 7.4.3.3 FPWM Mode Operation
        4. 7.4.3.4 Minimum On-time (High Input Voltage) Operation
        5. 7.4.3.5 Dropout
        6. 7.4.3.6 Recovery from Dropout
        7. 7.4.3.7 Other Fault Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Choosing the Switching Frequency
        2. 8.2.2.2  Setting the Output Voltage
        3. 8.2.2.3  Inductor Selection
        4. 8.2.2.4  Output Capacitor Selection
        5. 8.2.2.5  Input Capacitor Selection
        6. 8.2.2.6  BOOT Capacitor
        7. 8.2.2.7  VCC
        8. 8.2.2.8  CFF and RFF Selection
        9. 8.2.2.9  SYNCHRONIZATION AND MODE
        10. 8.2.2.10 External UVLO
        11. 8.2.2.11 Typical Thermal Performance
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Ground and Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Wettable Flanks

100% automated visual inspection (AVI) post-assembly is typically required to meet requirements for high reliability and robustness. Optimized QFN packages do not have solderable or exposed pins and terminals that are easily viewed. Visually determining whether or not the package is successfully soldered onto the printed-circuit board (PCB) is therefore difficult. The wettable-flank process was developed to resolve the issue of side-lead wetting of leadless packaging. The LM644A2-Q1 is assembled using a 24-pin, enhanced HotRod QFN package with wettable flanks to provide a visual indicator of solderability, which reduces the inspection time and manufacturing costs.