SNVSCW0 October   2024 LM68680-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device Comparison Table
  6. 5Device and Documentation Support
    1. 5.1 Development Support
    2. 5.2 Documentation Support
      1. 5.2.1 Related Documentation
        1. 5.2.1.1 PCB Layout Resources
        2. 5.2.1.2 Thermal Design Resources
    3. 5.3 Receiving Notification of Documentation Updates
    4. 5.4 Support Resources
    5. 5.5 Trademarks
    6. 5.6 Electrostatic Discharge Caution
    7. 5.7 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • RZY|26
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Electrostatic Discharge Caution

LM68680-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.