SNOS760D May   1999  – February 2024 LM7171

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics: ±15V
    6. 5.6 Electrical Characteristics: ±5V
    7. 5.7 Typical Characteristics: LM7171A
    8. 5.8 Typical Characteristics: LM7171B
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Circuit Operation
      2. 6.1.2 Slew Rate Characteristic
        1. 6.1.2.1 Slew-Rate Limitation
      3. 6.1.3 Compensation for Input Capacitance
    2. 6.2 Typical Applications
    3. 6.3 Power Supply Recommendations
      1. 6.3.1 Power-Supply Bypassing
      2. 6.3.2 Termination
      3. 6.3.3 Driving Capacitive Loads
      4. 6.3.4 Power Dissipation
    4. 6.4 Layout
      1. 6.4.1 Layout Guidelines
        1. 6.4.1.1 Printed Circuit Board and High-Speed Op Amps
        2. 6.4.1.2 Using Probes
        3. 6.4.1.3 Component Selection and Feedback Resistor
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4.1.1 Printed Circuit Board and High-Speed Op Amps

There are many things to consider when designing printed circuit boards (PCBs) for high-speed op amps. Without proper caution, excessive ringing, oscillation, and other degraded ac performance can easily occur in high-speed circuits. As a rule, keep signal traces short and wide to provide low inductance and low impedance paths. Ground any unused board space to reduce stray signal pickup. Ground critical components at a common point to eliminate voltage drop. Sockets add capacitance to the board and can affect high-frequency performance. Soldering the amplifier directly into the PCB without using any socket is better.