SNOS879I August   1999  – May 2016 LM7301

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: 5-V DC
    6. 6.6 Electrical Characteristics: AC
    7. 6.7 Electrical Characteristics: 2.2-V DC
    8. 6.8 Electrical Characteristics: 30-V DC
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Capacitive Load Driving
      2. 7.2.2 Transient Response
      3. 7.2.3 Wide Supply Range
      4. 7.2.4 Specific Advantages of 5-Pin SOT-23 (TinyPak)
      5. 7.2.5 Low-Distortion, High-Output Drive Capability
    3. 7.3 Device Functional Modes
      1. 7.3.1 Stability Considerations
      2. 7.3.2 Power Dissipation
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Handheld Remote Controls
      2. 8.1.2 Remote Microphone in Personal Computers
      3. 8.1.3 Optical Line Isolation for Modems
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selecting RSENSE
        2. 8.2.2.2 Selecting R1, and R3 Values
        3. 8.2.2.3 R1, R2 Selection
        4. 8.2.2.4 Error Terms Expressions
        5. 8.2.2.5 Frequency Response
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resource
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.