SNOSDB7 December   2020 LM74500-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Voltage
      2. 8.3.2 Charge Pump
      3. 8.3.3 Gate Driver
      4. 8.3.4 Enable
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Conduction Mode
  9. 9 Application and Implementation
    1. 9.1 Reverse Battery Protection for Automotive Body Control Module Applications
    2. 9.2 Reverse Polarity Protection
    3. 9.3 Application Information
      1. 9.3.1 Typical Application
        1. 9.3.1.1 Design Requirements
        2. 9.3.1.2 Detailed Design Procedure
          1. 9.3.1.2.1 Design Considerations
          2. 9.3.1.2.2 MOSFET Selection
          3. 9.3.1.2.3 Charge Pump VCAP, Input and Output Capacitance
        3. 9.3.1.3 Selection of TVS Diodes for 12-V Battery Protection Applications
        4. 9.3.1.4 Selection of TVS Diodes and MOSFET for 24-V Battery Protection Applications
        5. 9.3.1.5 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM74500-Q1 UNIT
DDF (SOT)
8 PINS
RθJA Junction-to-ambient thermal resistance 133.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 72.6 °C/W
RθJB Junction-to-board thermal resistance 54.5 °C/W
ΨJT Junction-to-top characterization parameter 4.6 °C/W
ΨJB Junction-to-board characterization parameter 54.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.