SNOSDF6 October   2023 LM74930-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Charge Pump
      2. 7.3.2  Dual Gate Control (DGATE, HGATE)
        1. 7.3.2.1 Load Disconnect Switch Control (HGATE, OUT)
        2. 7.3.2.2 Reverse Battery Protection (A, C, DGATE)
      3. 7.3.3  Overcurrent Protection (CS+, CS-, ILIM, IMON, TMR)
      4. 7.3.4  Overcurrent Protection with Circuit Breaker (ILIM, TMR)
      5. 7.3.5  Overcurrent Protection With Latch-Off
      6. 7.3.6  Short-Circuit Protection (ISCP)
        1. 7.3.6.1 Device Wake-Up With Output Short-Circuit Condition
      7. 7.3.7  Analog Current Monitor Output (IMON)
      8. 7.3.8  Overvoltage and Undervoltage Protection (OV, UVLO, OVCLAMP)
      9. 7.3.9  Disabling Reverse Current Blocking Functionality (MODE)
      10. 7.3.10 Device Functional Modes
        1. 7.3.10.1 Low Quiescent Current Shutdown Mode (EN)
  9. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application: 200-V Unsuppressed Load Dump Protection Application
      1. 8.2.1 Design Requirements for 200-V Unsuppressed Load Dump Protection
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  VS Capacitance, Resistor R1 and Zener Clamp (DZ)
        2. 8.2.2.2  Charge Pump Capacitance VCAP
        3. 8.2.2.3  Input and Output Capacitance
        4. 8.2.2.4  Overvoltage and Undervoltage Protection Component Selection
        5. 8.2.2.5  Selection of Scaling Resistor (RSET) and Short-Circuit Protection Setting Resistor (RSCP)
        6. 8.2.2.6  Overcurrent Limit (ILIM), Circuit Breaker Timer (TMR), and Current Monitoring Output (IMON) Selection
        7. 8.2.2.7  Selection of Current Sense Resistor, RSNS
        8. 8.2.2.8  Hold-Up Capacitance
        9. 8.2.2.9  MOSFET Q1 Selection
        10. 8.2.2.10 MOSFET Q2 Selection
        11. 8.2.2.11 Input TVS Selection
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Transient Protection
      2. 8.4.2 TVS Selection for 12-V Battery Systems
      3. 8.4.3 TVS Selection for 24-V Battery Systems
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

GUID-20231012-SS0I-CDVF-0RHW-02MRKG7SDD5H-low.svgFigure 6-1 Operating Quiescent Current vs Supply Voltage
GUID-20231012-SS0I-DTHS-4XZN-CTQ46GZGBKLK-low.svg
Figure 6-3 Charge Pump Current vs Supply Voltage at CAP – VS ≥ 6 V
GUID-20230530-SS0I-C6KX-TKPL-HKWXMBVC3ZB1-low.svg
Figure 6-5 DGATE Drive Voltage vs Supply Voltage
GUID-20230530-SS0I-DNQB-N1MS-4JMVWQZQFLZZ-low.svg
Figure 6-7 ANODE Leakage Current vs Reverse ANODE Voltage
GUID-20230530-SS0I-CB80-483F-F10ZGRXPBZBR-low.svg
Figure 6-9 OV Threshold vs Temperature
GUID-20231012-SS0I-HLLX-M94K-1NS0VGLSDF6C-low.svgFigure 6-11 ISCP to CS– Threshold vs Temperature (HV SCP Comparator)
GUID-20231012-SS0I-KVDJ-LWV5-1W7VQGZXGBJQ-low.svgFigure 6-13 ISCP Bias Current vs Temperature
GUID-20230530-SS0I-Q0KZ-2LG2-RN9HCVVWFTCF-low.svgFigure 6-15 VS POR Threshold vs Temperature
GUID-20231012-SS0I-MDCF-F13C-MHWF5DBNBXWS-low.svgFigure 6-17 DGATE Turn-On Delay During Forward Conduction
GUID-20231012-SS0I-G6WX-DR8Z-LR6HXTRS8PJB-low.svgFigure 6-19 HGATE Turn-OFF Delay During Output Short Circuit Condition
GUID-20231012-SS0I-WQCX-CMX1-PZ5FBKKDTXRF-low.svgFigure 6-2 Shutdown Current vs Supply Voltage
GUID-20231012-SS0I-RQTX-1D2R-WRWWMSSMLVHC-low.svg
Figure 6-4 Charge Pump V-I Characteristics at VS ≥ 12 V
GUID-20230530-SS0I-B3K7-BJSM-835QCRW3FDGT-low.svg
Figure 6-6 HGATE Drive Voltage vs Supply Voltage
GUID-20230530-SS0I-RKSP-KD8R-Z58QVSTPT9QV-low.svg
Figure 6-8 UVLO Threshold vs Temperature
GUID-20231012-SS0I-VP0L-JJQQ-ZTFKNLVVZ3SV-low.svg
Figure 6-10 Charge Pump UVLO Threshold vs Temperature
GUID-20231012-SS0I-5QCK-Z0KJ-QK88JS2N0PVX-low.svgFigure 6-12 ISCP to CS– Threshold vs Temperature (LV SCP Comparator)
GUID-20230530-SS0I-1MBM-CQ10-XBNTMPRNVJST-low.svg
Figure 6-14 VA POR Threshold vs Temperature
GUID-20231012-SS0I-STWQ-VQPS-SKVBXSBCFFNF-low.svgFigure 6-16 DGATE Turn OFF Delay
GUID-20231012-SS0I-SK9T-4C1P-0S5LSGLKFJPK-low.svgFigure 6-18 HGATE Turn-OFF Delay During Input Overvoltage Condition
GUID-20230630-SS0I-6BXM-HH8W-PSHRZGR9L4ZQ-low.svgFigure 6-20 Current Monitor Output vs Sense Voltage (RIMON = 5 kΩ, RSET = 50 Ω)