SNIS153D July   2009  – October 2015 LM75B

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Temperature-to-Digital Converter Characteristics
    6. 6.6 Digital DC Characteristics
    7. 6.7 I2C Digital Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Sensor
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C Bus Interface
      2. 7.5.2 Temperature Data Format
      3. 7.5.3 Shutdown Mode
      4. 7.5.4 Fault Queue
      5. 7.5.5 Comparator and Interrupt Mode
      6. 7.5.6 O.S. Output
      7. 7.5.7 O.S. Polarity
      8. 7.5.8 Internal Register Structure
    6. 7.6 Register Maps
      1. 7.6.1 Pointer Register (Selects Which Registers Will Be Read From or Written to):
      2. 7.6.2 Temperature Register (Read Only):
      3. 7.6.3 Configuration Register (Read/Write):
      4. 7.6.4 THYST and TOS Register (Read/Write):
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Simple Fan Controller, Interface Optional
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Simple Thermostat, Interface Optional
      2. 8.3.2 Temperature Sensor with Loudmouth Alarm (Barking Watchdog)
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Digital Noise Issues
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LM75B Click here Click here Click here Click here Click here
LM75C Click here Click here Click here Click here Click here

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.