SNVS754L January   2000  – June 2020 LM78L

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Package Options
  3. 3 Description
    1.     Fixed Output Regulator Circuit
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics — LM78L05
    6. 7.6  Electrical Characteristics — LM78L09
    7. 7.7  Electrical Characteristics — LM78L12
    8. 7.8  Electrical Characteristics — LM78L15
    9. 7.9  Electrical Characteristics — LM78L62
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Load Regulation
      2. 8.3.2 Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation
      2. 8.4.2 Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Fixed Output Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Input Capacitor
          2. 9.2.1.2.2 Output Capacitor
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Other Application Circuits
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) LM78Lxx UNIT
D (SOIC) LP (TO-92) YPB (DSBGA)
8 PINS 3 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 128.8 158.7 108.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 76 75.2 1.3 °C/W
RθJB Junction-to-board thermal resistance 69.3 n/a 31.4 °C/W
ψJT Junction-to-top characterization parameter 26.3 30.2 4.5 °C/W
ψJB Junction-to-board characterization parameter 68.8 138.2 31.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.