7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
|
MIN |
MAX |
UNIT |
VCC+ |
Supply voltage(2) |
|
18 |
V |
VCC– |
Supply voltage(2) |
|
–18 |
V |
VCC+ – VCC– |
Supply voltage |
|
36 |
V |
|
Input voltage, either input(2)(3) |
VCC– |
VCC+ |
V |
|
Input current(4) |
|
±10 |
mA |
|
Duration of output short circuit(5) |
Unlimited |
TJ |
Operating virtual junction temperature |
|
150 |
°C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–.
(3) The magnitude of the input voltage must never exceed the magnitude of the supply voltage.
(4) Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless some limiting resistance is used.
(5) The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure the maximum dissipation rating is not exceeded.
7.2 Handling Ratings
PARAMETER |
DEFINITION |
MIN |
MAX |
UNIT |
Tstg |
Storage temperature range |
–65 |
150 |
°C |
V(ESD) |
Human-Body Model (HBM)(1) |
0 |
2.5 |
kV |
Charged-Device Model (CDM)(2) |
0 |
1.5 |
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.4 Thermal Information
THERMAL METRIC(1) |
LM833 |
UNIT |
D |
DGK |
P |
8 PINS |
RθJA |
Junction-to-ambient thermal resistance(2)(3) |
97 |
172 |
85 |
°C/W |
(1) For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics application report (
SPRA953).
(2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA) / θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.