SNIS133E September   2003  – February 2024 LM95010

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Operating Ratings
    3. 5.3 DC Electrical Characteristics
    4. 5.4 AC Electrical Characteristics
    5. 5.5 Typical Performance Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  SensorPath BUS SWD
      2. 6.3.2  SensorPath BIT SIGNALING
      3. 6.3.3  Bus Inactive
      4. 6.3.4  Data Bit 0 and 1
      5. 6.3.5  Start Bit
      6. 6.3.6  Attention Request
      7. 6.3.7  Bus Reset
      8. 6.3.8  SensorPath BUS TRANSACTIONS
      9. 6.3.9  Bus Reset Operation
      10. 6.3.10 Read Transaction
      11. 6.3.11 Write Transaction
      12. 6.3.12 Read and Write Transaction Exceptions
      13. 6.3.13 Attention Request Transaction
  8. 7 Register Set
    1. 7.1  Fixed Number Setting
    2. 7.2  Register Set Summary
    3. 7.3  Device Reset Operation
    4. 7.4  Device Number (Addr 00o)
    5. 7.5  Manufacturer ID (Addr 01o)
    6. 7.6  Device ID (Addr 02o)
    7. 7.7  Capabilities Fixed (Addr 03o)
    8. 7.8  Device Status (Addr 04o)
    9. 7.9  Device Control (Addr 05o)
    10. 7.10 Temperature Measurement Function (TYPE - 0001)
    11. 7.11 Operation
    12. 7.12 Temperature Capabilities (Addr 10o)
    13. 7.13 Temperature Data Readout (Addr 11o)
    14. 7.14 Temperature Control (Addr 12o)
    15. 7.15 Conversion Rate (Addr 40o)
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Mounting Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision D (March 2013) to Revision E (November 2023)

  • Updated format to match new TI layout and flow. Tables, figures and cross-references use a new numbering sequence throughout the documentGo

Changes from Revision C (May 2004) to Revision D (March 2013)

  • Changed layout of National Data Sheet to TI formatGo