SNIS146B March 2007 – October 2017 LM95214
PRODUCTION DATA.
PIN | DESCRIPTION | ||
---|---|---|---|
NO. | NAME | ||
1 | NC | No Connect Not connected. May be left floating, connected to GND or VDD. |
|
2 | VDD | Positive Supply Voltage Input DC Voltage from 3.0 V to 3.6 V. VDD must be bypassed with a 0.1-µF capacitor in parallel with 100 pF. The 100-pF capacitor must be placed as close as possible to the power supply pin. Noise must be kept below 200 mVp-p, a 10-µF capacitor may be required to achieve this. |
|
3 | D4+ | Diode Current Source Fourth Diode Anode. Connected to remote discrete diode-connected transistor junction or to the diode-connected transistor junction on a remote IC whose die temperature is being sensed. A capacitor is not required between D4+ and D–. A 100 pF capacitor between D4+ and D– can be added and may improve performance in noisy systems. Float this pin if this thermal diode is not used. |
|
4 | D3+ | Diode Current Source Third Diode Anode. Connected to remote discrete diode-connected transistor junction or to the diode-connected transistor junction on a remote IC whose die temperature is being sensed. A capacitor is not required between D3+ and D–. A 100-pF capacitor between D3+ and D– can be added and may improve performance in noisy systems. Float this pin if this thermal diode is not used. |
|
5 | D− | Diode Return Current Sink All Diode Cathodes. Common D– pin for all four remote diodes. |
|
6 | D2+ | Diode Current Source Second Diode Anode. Connected to remote discrete diode-connected transistor junction or to the diode-connected transistor junction on a remote IC whose die temperature is being sensed. A capacitor is not required between D2+ and D–. A 100-pF capacitor between D2+ and D– can be added and may improve performance in noisy systems. Float this pin if this thermal diode is not used. |
|
7 | D1+ | Diode Current Source First Diode Anode. Connected to remote discrete diode-connected transistor junction or to the diode-connected transistor junction on a remote IC whose die temperature is being sensed. A capacitor is not required between D1+ and D–. A 100-pF capacitor between D1+ and D– can be added and may improve performance in noisy systems. Float this pin if this thermal diode is not used. |
|
8 | GND | Power Supply Ground -- System low noise ground. | |
9 | A0 | Digital Input SMBus slave address select pin. Selects one of three addresses. Can be tied to VDD, GND, or to the middle of a resistor divider connected between VDD and GND. |
|
10 | TCRIT1 | Digital Output, Open-Drain Critical temperature output 1. Requires pullup resistor. Active LOW. |
|
11 | TCRIT2 | Digital Output, Open-Drain Critical temperature output 2. Requires pullup resistor. Active LOW. |
|
12 | SMBDAT | SMBus Bidirectional Data Line, Open-Drain Output From and to Controller; may require an external pullup resistor |
|
13 | SMBCLK | SMBus Clock Input From Controller; may require an external pullup resistor |
|
14 | TCRIT3 | Digital Output, Open-Drain Critical temperature output 3. Requires pullup resistor. Active LOW. |
PIN NO. | LABEL | CIRCUIT | CIRCUITS FOR PIN ESD PROTECTION STRUCTURE |
---|---|---|---|
1 | NC | – | |
2 | VDD | A | |
3 | D4+ | A | |
4 | D3+ | A | |
5 | D- | A | |
6 | D2+ | A | |
7 | D1+ | A | Circuit A |
8 | GND | – | |
9 | A0 | B | |
10 | TCRIT1 | B | |
11 | TCRIT2 | B | |
12 | SMBDAT | B | |
13 | SMBCLK | B | |
14 | TCRIT2 | B | Circuit B |