SNIS139F February   2005  – January 2024 LM95231

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Operating Ratings
    3. 5.3 Temperature-to-Digital Converter Characteristics
    4. 5.4 Logic Electrical Characteristics Digital DC Characteristics
    5. 5.5 Logic Electrical Characteristics SMBus Digital Switching Characteristics
    6. 5.6 Typical Performance Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Conversion Sequence
      2. 6.3.2 Power-On-Default States
      3. 6.3.3 SMBus Interface
      4. 6.3.4 Temperature Data Format
      5. 6.3.5 SMBDAT Open-Drain Output
      6. 6.3.6 Diode Fault Detection
      7. 6.3.7 Communicating with the LM95231
      8. 6.3.8 Serial Interface Reset
      9. 6.3.9 One-Shot Conversion
  8. 7 Registers
    1. 7.1 LM95231 Registers
    2. 7.2 Status Register
    3. 7.3 Configuration Register
    4. 7.4 Remote Diode Filter Control Register
    5. 7.5 Remote Diode Model Type Select Register
    6. 7.6 Remote TruTherm Mode Control
    7. 7.7 Local and Remote MSB and LSB Temperature Registers
      1. 7.7.1 Local Temperature MSB
      2. 7.7.2 Local Temperature LSB
      3. 7.7.3 Remote Temperature MSB
      4. 7.7.4 Remote Temperature LSB
    8. 7.8 Manufacturers ID Register
    9. 7.9 Die Revision Code Register
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Diode Non-Ideality
        1. 8.2.1.1 Diode Non-Ideality Factor Effect on Accuracy
        2. 8.2.1.2 Calculating Total System Accuracy
        3. 8.2.1.3 Compensating for Different Non-Ideality
  10. 9 Layout
    1. 9.1 PCB Layout for Minimizing Noise
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision E (March 2013) to Revision F (January 2024)

  • Updated format to match new TI layout and flow. Tables, figures and cross-references use a new numbering sequence throughout the documentGo

Changes from Revision D (August 2006) to Revision E (March 2013)

  • Changed layout of National Data Sheet to TI formatGo