SNAS461G May   2010  – November 2018 LM98640QML-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings    
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information         
    5. 6.5 Quality Conformance Inspection
    6. 6.6 LM98640QML-SP Electrical Characteristics
    7. 6.7 AC Timing Specifications
    8. 6.8 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Sampling Modes
        1. 7.3.1.1 Sample & Hold Mode
          1. 7.3.1.1.1 Sample & Hold Mode CLAMP/SAMPLE Adjust
        2. 7.3.1.2 CDS Mode
          1. 7.3.1.2.1 CDS Mode Bimodal Offset
          2. 7.3.1.2.2 CDS Mode CLAMP/SAMPLE Adjust
      2. 7.3.2 Input Bias and Clamping
        1. 7.3.2.1 Sample and Hold Mode Biasing
        2. 7.3.2.2 CDS Mode Biasing
        3. 7.3.2.3 VCLP DAC
      3. 7.3.3 Programmable Gain
        1. 7.3.3.1 CDS/SH Stage Gain
        2. 7.3.3.2 PGA Gain Plots
      4. 7.3.4 Programmable Analog Offset Correction
      5. 7.3.5 Analog to Digital Converter
      6. 7.3.6 LVDS Output
        1. 7.3.6.1 LVDS Output Voltage
        2. 7.3.6.2 LVDS Output Modes
        3. 7.3.6.3 TXFRM Output
          1. 7.3.6.3.1 Output Mode 1 - Dual Lane
          2. 7.3.6.3.2 Output Mode 2 - Quad Lane
      7. 7.3.7 Clock Receiver
      8. 7.3.8 Power Trimming
    4. 7.4 Device Functional Mode
      1. 7.4.1 Powerdown Modes
      2. 7.4.2 LVDS Test Modes
        1. 7.4.2.1 Test Mode 0 - Fixed Pattern
        2. 7.4.2.2 Test Mode 1 - Horizontal Gradient
        3. 7.4.2.3 Test Mode 2 - Vertical Gradient
        4. 7.4.2.4 Test Mode 3 - Lattice Pattern
        5. 7.4.2.5 Test Mode 4 - Stripe Pattern
        6. 7.4.2.6 Test Mode 5 - LVDS Test Pattern (Synchronous)
        7. 7.4.2.7 Test Mode 6 - LVDS Test Pattern (Asynchronous)
        8. 7.4.2.8 Pseudo Random Number Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Writing to the Serial Registers
      3. 7.5.3 Reading the Serial Registers
      4. 7.5.4 Serial Interface Timing Details
    6. 7.6 Register Maps
      1. 7.6.1 Register Definitions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Total Ionizing Dose
      2. 8.1.2 Single Event Latch-Up and Functional Interrupt
      3. 8.1.3 Single Event Effects
    2. 8.2 Typical Application
      1. 8.2.1 Sample/Hold Mode
    3. 8.3 Initialization Set Up
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Power Planes
      2. 9.1.2 Bypass Capacitors
      3. 9.1.3 Ground Plane
      4. 9.1.4 Thermal Management
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Evaluation Board
        2. 10.1.1.2 Register Programming Software
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Export Control Notice
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Engineering Samples

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NBB|68
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (October 2018) to G Revision

  • Changed pin diagram in Pin Configuration and Functions section to correct typographical errorGo

Changes from E Revision (December 2017) to F Revision

  • Deleted Operating Life Test Delta Parameters Table Go
  • Updated Features section bullets to include SMD informationGo
  • Updated Applications sectionGo
  • Added new orderable to the Device Information tableGo
  • Added engineering samples footnoteGo
  • Deleted LM98640-MDR and LM9864-MDP from the Device Information tableGo
  • Updated thermal metrics Go
  • Deleted 15 MHz and 25 MHz min/max specGo
  • Changed ENOB typical for subgroup 6 at 25 MHz Go
  • Added minimum spec value for ENOB subgroups 4,5 at 40 MHz Go
  • Changed pulses to windowsGo
  • Updated wording in CDS Mode CLAMP/SAMPLE Adjust section Go
  • Updated wording in Input Bias and Clamping section Go

Changes from D Revision (September 2015) to E Revision

  • Changed 64 Lead to 68 Lead in the Device Information tableGo

Changes from C Revision (April 2013) to D Revision

  • Added, updated, or revised the following sections in accordance with new datasheet standards: Description, Pin Configuration and Functions, Specifications, Detailed Description, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, Mechanical, Packaging, and Ordering InformationGo
  • Changed CLPIN IIH from 44 to 100 μAGo
  • Changed SEN IIH from 28 to 100 μA Go
  • Changed SEN IIL from –70 to –100 μAGo
  • Changed INCLK IIHL from 36 to 100 μA Go
  • Added mininum limits for tDSO, tDSE, tQSR and tQHF and deleted maximum limitsGo
  • Added details on register write. Go
  • Changed Device Revision ID from x01 to x48 Go
  • Changed Device Revision ID from x01 to x48 Go
  • Added TID test and ELDRS-free information Go

Changes from B Revision (January 2011) to C Revision

  • layout of datasheet from National to TI formatGo