SNAS461G May   2010  – November 2018 LM98640QML-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings    
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information         
    5. 6.5 Quality Conformance Inspection
    6. 6.6 LM98640QML-SP Electrical Characteristics
    7. 6.7 AC Timing Specifications
    8. 6.8 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Sampling Modes
        1. 7.3.1.1 Sample & Hold Mode
          1. 7.3.1.1.1 Sample & Hold Mode CLAMP/SAMPLE Adjust
        2. 7.3.1.2 CDS Mode
          1. 7.3.1.2.1 CDS Mode Bimodal Offset
          2. 7.3.1.2.2 CDS Mode CLAMP/SAMPLE Adjust
      2. 7.3.2 Input Bias and Clamping
        1. 7.3.2.1 Sample and Hold Mode Biasing
        2. 7.3.2.2 CDS Mode Biasing
        3. 7.3.2.3 VCLP DAC
      3. 7.3.3 Programmable Gain
        1. 7.3.3.1 CDS/SH Stage Gain
        2. 7.3.3.2 PGA Gain Plots
      4. 7.3.4 Programmable Analog Offset Correction
      5. 7.3.5 Analog to Digital Converter
      6. 7.3.6 LVDS Output
        1. 7.3.6.1 LVDS Output Voltage
        2. 7.3.6.2 LVDS Output Modes
        3. 7.3.6.3 TXFRM Output
          1. 7.3.6.3.1 Output Mode 1 - Dual Lane
          2. 7.3.6.3.2 Output Mode 2 - Quad Lane
      7. 7.3.7 Clock Receiver
      8. 7.3.8 Power Trimming
    4. 7.4 Device Functional Mode
      1. 7.4.1 Powerdown Modes
      2. 7.4.2 LVDS Test Modes
        1. 7.4.2.1 Test Mode 0 - Fixed Pattern
        2. 7.4.2.2 Test Mode 1 - Horizontal Gradient
        3. 7.4.2.3 Test Mode 2 - Vertical Gradient
        4. 7.4.2.4 Test Mode 3 - Lattice Pattern
        5. 7.4.2.5 Test Mode 4 - Stripe Pattern
        6. 7.4.2.6 Test Mode 5 - LVDS Test Pattern (Synchronous)
        7. 7.4.2.7 Test Mode 6 - LVDS Test Pattern (Asynchronous)
        8. 7.4.2.8 Pseudo Random Number Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Writing to the Serial Registers
      3. 7.5.3 Reading the Serial Registers
      4. 7.5.4 Serial Interface Timing Details
    6. 7.6 Register Maps
      1. 7.6.1 Register Definitions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Total Ionizing Dose
      2. 8.1.2 Single Event Latch-Up and Functional Interrupt
      3. 8.1.3 Single Event Effects
    2. 8.2 Typical Application
      1. 8.2.1 Sample/Hold Mode
    3. 8.3 Initialization Set Up
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Power Planes
      2. 9.1.2 Bypass Capacitors
      3. 9.1.3 Ground Plane
      4. 9.1.4 Thermal Management
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Evaluation Board
        2. 10.1.1.2 Register Programming Software
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Export Control Notice
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Engineering Samples

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NBB|68
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information(2)         

THERMAL METRIC(1) LM98640QML-SP UNIT
NBB (CFP)
68 PINS
RθJA Junction-to-ambient thermal resistance 16.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 3.8
RθJB Junction-to-board thermal resistance 7.6
ψJT Junction-to-top characterization parameter 1.7
ψJB Junction-to-board characterization parameter 7.2
RθJC(bottom) Junction-to-case (bottom) thermal resistance 0.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA and the ambient temperature, TA. The maximum allowable power dissipation at any temperature is PD = (TJMAX – TA) / θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided