SNAS558N January   2000  – March 2024 LMC555

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low-Power Dissipation
      2. 7.3.2 Various Packages and Compatibility
      3. 7.3.3 Operates in Both Astable and Monostable Mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Monostable Operation
      2. 7.4.2 Astable Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Flash LED in Monostable Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Frequency Divider
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Application Curve
      3. 8.2.3 Pulse Width Modulator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Application Curve
      4. 8.2.4 Pulse Position Modulator
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Application Curve
      5. 8.2.5 50% Duty Cycle Oscillator
        1. 8.2.5.1 Design Requirements
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • YPB|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The LMC555 device is a CMOS version of the industry standard 555 series general-purpose timers. In addition to the standard SOIC, VSSSOP, and PDIP packages, the LMC555 is also available in a chip-sized, 8-bump DSBGA package using TI's DSBGA package technology. The LMC555 offers the same capability of generating accurate time delays and frequencies as the LM555, but with much lower power dissipation and supply current spikes. When operated as a one-shot, the time delay is precisely controlled by a single external resistor and capacitor. In astable mode, the oscillation frequency and duty cycle are accurately set by two external resistors and one capacitor. TI's LMCMOS process extends both the frequency range and the low supply capability.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
LMC555 D (SOIC, 8) 4.9mm × 6mm
DGK (VSSOP, 8) 3mm × 4.9mm
P (PDIP, 8) 9.81mm × 9.43mm
YBF (DSBGA, 8) 1.75mm × 1.75mm
(1) For more information, see Section 11.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.

 

GUID-63B0926D-473A-4AF7-826A-37639560307D-low.pngPulse Width Modulator
GUID-B32A1FEB-97B8-47E2-A31F-CB5B8F2056D5-low.pngPulse Width Modulator Waveform:
Top Waveform—Modulation
Bottom Waveform—Output Voltage