SBOSAM6 January   2000  – December 2024 LMC6035-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Capacitive Load Tolerance
    2. 7.2 Typical Applications
      1. 7.2.1 Differential Driver
      2. 7.2.2 Low-Pass Active Filter
        1. 7.2.2.1 Low-Pass Frequency Scaling Procedure
      3. 7.2.3 High-Pass Active Filter
        1. 7.2.3.1 High-Pass Frequency Scaling Procedure
      4. 7.2.4 Dual-Amplifier Bandpass Filter
        1. 7.2.4.1 DABP Component Selection Procedure
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 Printed Circuit Board (PCB) Layout for High-Impedance Work
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3.     Trademarks
    4. 8.3 Electrostatic Discharge Caution
    5. 8.4 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.2.1 Low-Pass Frequency Scaling Procedure

The actual component values represented in bold of Figure 7-7 were obtained with the following scaling procedure:

  1. First determine the frequency scaling factor (FSF) for the desired cutoff frequency. Choosing fc at 3kHz, provides the following FSF computation:
    Equation 1. F S F =   2 π × 300 k H z = 18.84 k
  2. Then divide all of the normalized capacitor values by the FSF as follows (C1' and C2': prior to impedance scaling):
    Equation 2. C 1' =   C 1 n o r m a l i z e d F S F = 0.707 18.84 k = 37.93 × 10 - 6 F
    Equation 3. C 2' =   C 1 n o r m a l i z e d F S F = 1.414 18.84 k = 75.05 × 10 - 6 F
  3. Last, choose an impedance scaling factor (Z). This Z factor can be calculated from a standard value for C2. Then Z can be used to determine the remaining component values as follows:
    Equation 4. Z =   C 2' C 2 c h o s e n = 75.05 × 10 - 6 F 6.8 n F = 8.4 k
    Equation 5. C 1 =   C 1 ' Z = 37.93 × 10 - 6 F 8.4 k = 4.52 n F
    Equation 6. R 1 =   R 1 n o r m a l i z e d × Z = 1 Ω   × 8.4 k = 8.4 k Ω
    Equation 7. R 2 =   R 2 n o r m a l i z e d × Z = 1 Ω   × 8.4 k = 8.4 k Ω
  4. A standard value of 8.45kΩ is chosen for R1 and R2.