SNOS875H January   2000  – December 2024 LMC6035 , LMC6036

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: LMC6035
    5. 5.5 Thermal Information: LMC6036
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Capacitive Load Tolerance
    2. 7.2 Typical Applications
      1. 7.2.1 Differential Driver
      2. 7.2.2 Low-Pass Active Filter
        1. 7.2.2.1 Low-Pass Frequency Scaling Procedure
      3. 7.2.3 High-Pass Active Filter
        1. 7.2.3.1 High-Pass Frequency Scaling Procedure
      4. 7.2.4 Dual-Amplifier Bandpass Filter
        1. 7.2.4.1 DABP Component Selection Procedure
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 Printed Circuit Board (PCB) Layout for High-Impedance Work
        2. 7.3.1.2 DSBGA Considerations
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3.     Trademarks
    4. 8.3 Electrostatic Discharge Caution
    5. 8.4 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • YAF|8
  • DGK|8
  • YZR|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision G (April 2013) to Revision H (December 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Moved LMC6035-Q1 to a new documentGo
  • Updated Description text for clarityGo
  • Updated front-page imageGo
  • Added difference amplifier with RES11 application imageGo
  • Added Pin Configuration and Functions Go
  • Updated figures and tables in Pin Configuration and Functions Go
  • Added input pin voltage to Absolute Maximum Ratings Go
  • Added ESD Ratings Go
  • Deleted machine model in ESD Ratings Go
  • Added Thermal InformationGo
  • Updated junction-to-ambient thermal resistance valuesGo
  • Updated parameter names and symbolsGo
  • Added input voltage noise density specification for V+ = 15VGo
  • Changed input current noise density TYP from 0.2fA/√Hz to 6fA/√Hz Go
  • Deleted footnotes 1 and 2 from DC Electrical Characteristics Go
  • Moved footnotes 4 into open-loop gain test conditionsGo
  • Deleted footnote 1 from AC Electrical Characteristics Go
  • Updated footnote 2 and moved conditions to slew rate test conditionsGo
  • Moved footnote 3 from AC Electrical Characteristics conditions crosstalk test conditionsGo
  • Added Figures 5-3, 5-4, 5-17Go
  • Deleted Figures 16 and 17Go
  • Added Overview Go
  • Added Functional Block Diagram Go
  • Changed AVOL to AOL Go
  • Updated Figure 7-7Go
  • Updated Figure 7-8Go
  • Updated Figure 7-9Go
  • Changed the value of fc from 3kHz to 1kHz to fix error in equationGo
  • Added reference to Measurement and Calibration Techniques for Ultra-low Current Measurement Systems application note in Printed Circuit Board (PCB) Layout for High-Impedance WorkGo
  • Updated thermal resistance information in DSBGA Considerations Go