SNOS875H January   2000  – December 2024 LMC6035 , LMC6036

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: LMC6035
    5. 5.5 Thermal Information: LMC6036
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Capacitive Load Tolerance
    2. 7.2 Typical Applications
      1. 7.2.1 Differential Driver
      2. 7.2.2 Low-Pass Active Filter
        1. 7.2.2.1 Low-Pass Frequency Scaling Procedure
      3. 7.2.3 High-Pass Active Filter
        1. 7.2.3.1 High-Pass Frequency Scaling Procedure
      4. 7.2.4 Dual-Amplifier Bandpass Filter
        1. 7.2.4.1 DABP Component Selection Procedure
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 Printed Circuit Board (PCB) Layout for High-Impedance Work
        2. 7.3.1.2 DSBGA Considerations
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3.     Trademarks
    4. 8.3 Electrostatic Discharge Caution
    5. 8.4 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • YAF|8
  • DGK|8
  • YZR|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Differential input voltage ±Supply voltage V
VS Supply voltage, VS = (V+) – (V–) 0 16 V
ISC Output short circuit To V+ See(3) mA
To V– See(4)
Voltage at input pin  (V–) – 0.3 (V+) + 0.3 V
Current at input pin ±5 mA
Current at output pin ±18 mA
Current at power supply pin 35 mA
TJ Junction temperature(5) 150 °C
Tstg Storage temperature –65 150 °C
Lead temperature (soldering, 10s) 260 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Do not connect output to V+, when V+ is greater than 13V or reliability is adversely affected.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over long term adversely affect reliability.
(5) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) – TA) / θJA