SNOS724F August   2000  – February 2024 LMC6492 , LMC6494

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Input Common-Mode Voltage Range
      2. 6.1.2 Rail-to-Rail Output
      3. 6.1.3 Compensating for Input Capacitance
      4. 6.1.4 Capacitive Load Tolerance
    2. 6.2 Typical Application
      1. 6.2.1 Application Circuits
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
        1. 6.3.1.1 Printed Circuit Board Layout For High-Impedance Work
  8. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Spice Macromodel
        2. 7.1.1.2 PSpice® for TI
        3. 7.1.1.3 TINA-TI™ Simulation Software (Free Download)
        4. 7.1.1.4 DIP-Adapter-EVM
        5. 7.1.1.5 DIYAMP-EVM
        6. 7.1.1.6 TI Reference Designs
        7. 7.1.1.7 Filter Design Tool
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4.     Trademarks
    5. 7.4 Electrostatic Discharge Caution
    6. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.