SNOSDA8C October   2020  – February 2024 LMG3422R050 , LMG3426R050

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Switching Parameters
      1. 6.1.1 Turn-On Times
      2. 6.1.2 Turn-Off Times
      3. 6.1.3 Drain-Source Turn-On Slew Rate
      4. 6.1.4 Turn-On and Turn-Off Switching Energy
      5. 6.1.5 Zero-Voltage Detection Times
    2. 6.2 Safe Operation Area (SOA)
      1. 6.2.1 Repetitive SOA
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 LMG3422R050 Functional Block Diagram
      2. 7.2.2 LMG3426R050 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  GaN FET Operation Definitions
      2. 7.3.2  Direct-Drive GaN Architecture
      3. 7.3.3  Drain-Source Voltage Capability
      4. 7.3.4  Internal Buck-Boost DC-DC Converter
      5. 7.3.5  VDD Bias Supply
      6. 7.3.6  Auxiliary LDO
      7. 7.3.7  Fault Protection
        1. 7.3.7.1 Overcurrent Protection and Short-Circuit Protection
        2. 7.3.7.2 Overtemperature Shutdown Protection
        3. 7.3.7.3 UVLO Protection
        4. 7.3.7.4 High-Impedance RDRV Pin Protection
        5. 7.3.7.5 Fault Reporting
      8. 7.3.8  Drive-Strength Adjustment
      9. 7.3.9  Temperature-Sensing Output
      10. 7.3.10 Ideal-Diode Mode Operation
        1. 7.3.10.1 Overtemperature-Shutdown Ideal-Diode Mode
      11. 7.3.11 Zero-Voltage Detection (ZVD)
    4. 7.4 Start-Up Sequence
    5. 7.5 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Slew Rate Selection
        2. 8.2.2.2 Signal Level-Shifting
        3. 8.2.2.3 Buck-Boost Converter Design
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Using an Isolated Power Supply
      2. 8.4.2 Using a Bootstrap Diode
        1. 8.4.2.1 Diode Selection
        2. 8.4.2.2 Managing the Bootstrap Voltage
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Solder-Joint Reliability
        2. 8.5.1.2 Power-Loop Inductance
        3. 8.5.1.3 Signal-Ground Connection
        4. 8.5.1.4 Bypass Capacitors
        5. 8.5.1.5 Switch-Node Capacitance
        6. 8.5.1.6 Signal Integrity
        7. 8.5.1.7 High-Voltage Spacing
        8. 8.5.1.8 Thermal Recommendations
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Export Control Notice
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • RQZ|54
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision B (May 2022) to Revision C (February 2024)

  • Removed LMG3425R050 device from the data sheet Go
  • Added LMG3426R050 device to the data sheet and set to Production DataGo
  • Removed Switching Performance at >100V/ns graphGo
  • Updated text and added table in the Description section. Removed Device Comparison section that was located after the Table of Contents section. Added table contains the information that was in the removed Device Comparison table.Go
  • Updated OC limit curve in Drain Current vs Drain-Source Voltage graph in Typical Characteristics section.Go
  • Moved Safe Operation Area (SOA) section out of the Feature Description section.Go
  • Updated title and added sentence after figure in the Repetitive SOA section.Go
  • Updated text in the Overview section.Go
  • Updated text in Direct-Drive GaN Architecture section.Go
  • Added sentence clarifying application usage in Drain-Source Voltage Capability sectionGo
  • Updated text in the Internal Buck-Boost DC-DC Converter section.Go
  • Updated text in the VDD Bias Supply section.Go
  • Updated title and text in the Fault Protection section.Go
  • Updated text and Figure 7-5 in the Overcurrent Protection and Short-Circuit Protection section.Go
  • Updated title in the Overtemperature Shutdown Protection section.Go
  • Added the High-Impedance RDRV Pin Protection section.Go
  • Updated text and table, and added table in the Fault Reporting section.Go
  • Converted text to a note in the Drive-Strength Adjustment section.Go
  • Updated text in the Temperature-Sensing Output section.Go
  • Updated text in the Overtemperature-Shutdown Ideal-Diode Mode section.Go
  • Replaced figure with two new figures in Typical Application section.Go
  • Removed the Startup and Slew Rate with Bootstrap High-Side Supply section.Go
  • Updated text in the Signal Level-Shifting section.Go
  • Updated text in the Using an Isolated Power Supply section.Go
  • Updated text in the Using a Bootstrap Diode section.Go
  • Added figure in the Layout Guidelines section.Go

Changes from Revision A (April 2021) to Revision B (May 2022)

  • Changed the data sheet status from Advance Information to Production DataGo