SNOSDL9 December   2024 LMG5126

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Device Configuration
      2. 6.3.2 Switching Frequency and Synchronization (SYNCIN)
      3. 6.3.3 Dual Random Spread Spectrum (DRSS)
      4. 6.3.4 Operation Modes (BYPASS, DEM, FPWM)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown State
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Feedback Compensation
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Determining the Duty Cycle
        2. 7.2.3.2 Timing Resistor RT
        3. 7.2.3.3 Vout Programming
        4. 7.2.3.4 Inductor Selection Lm
        5. 7.2.3.5 Output Capacitor Cout
      4. 7.2.4 Application Curves
        1. 7.2.4.1 Efficiency
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information
    3. 10.3 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
  • VBT|22
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

Over the recommended operating junction temperature range (unless otherwise specified)(1)
MIN MAX UNIT
Input(2) BIAS to AGND –0.3 50 V
UVLO/EN to AGND –0.3 BIAS + 0.3
CSA to AGND –0.3 50
CSA to CSB –0.3 0.3
VOUT to AGND -0.3 75
SW to AGND –5 75
SW to AGND (10ns) –15
CFG1, CFG2, SYNCIN, ATRK/DTRK, DLY, MODE, –0.3 5.5
RT to AGND –0.3 2.5
GND to AGND –0.3 0.3
GND to AGND (10ns) –2 2
Output(2) VCC to AGND –0.3 5.8(3) V
PGOOD, SYNCOUT, SS, COMP, IMON/ILIM  to AGND –0.3 5.5
Operating junction temperature, TJ(4) –40 150 °C
Storage temperature, TSTG –55 150
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) It is not allowed to apply an external voltage directly to COMP, SS, RT pins.
(3) Operating lifetime is derated when the pin voltage is greater than 5.5V.
(4) High junction temperatures degrade operating lifetimes. Operating lifetime is derated for junction temperatures greater than 125°C.