SNLS531B April   2016  – June 2018 LMH0324

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface AC Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) AC Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Input Configuration Pins
      2. 7.3.2 Carrier Detect
      3. 7.3.3 Adaptive Cable Equalizer
      4. 7.3.4 Launch Amplitude
      5. 7.3.5 Input-Output Mux Selection
      6. 7.3.6 Output Function Control
      7. 7.3.7 Output Driver Amplitude and De-Emphasis Control
      8. 7.3.8 Additional Programmability
        1. 7.3.8.1 Cable Length Indicator (CLI)
        2. 7.3.8.2 Digital MUTEREF
    4. 7.4 Device Functional Modes
      1. 7.4.1 System Management Bus (SMBus) Mode
        1. 7.4.1.1 SMBus Read and Write Transactions
          1. 7.4.1.1.1 SMBus Write Operation Format
          2. 7.4.1.1.2 SMBus Read Operation Format
      2. 7.4.2 Serial Peripheral Interface (SPI) Mode
        1. 7.4.2.1 SPI Read and Write Transactions
          1. 7.4.2.1.1 SPI Write Transaction Format
          2. 7.4.2.1.2 SPI Read Transaction Format
        2. 7.4.2.2 SPI Daisy Chain
    5. 7.5 LMH0324 Register Map
      1. 7.5.1 Share Register Page
      2. 7.5.2 CableEQ/Drivers Register Page
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for SMPTE Applications
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Recommended VOD and DE Register Settings
      4. 8.2.4 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RTW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
2.5 V Supplies VIN, VDDIO to VSS 2.375 2.5 2.625 V
1.8 V Supplies VIN, VDDIO , VDD_LDO to VSS 1.71 1.8 1.89 V
VDDSMBUS SMBus: SDA, SCL Open Drain Termination Voltage, VDDIO = 2.5 V 2.375 3.6 V
VLAUNCH Source Launch Amplitude before Coax 0.72 0.8 0.88 Vp-p
Splitter Mode 0.36 0.4 0.44
TJUNCTION Operating Junction Temperature 100 °C
TAMBIENT Ambient Temperature –40 25 85 °C
NPS(1) Supply Noise 50 Hz to 1 MHz, Sinusoidal <20 mVp-p
1.1 MHz to 6 GHz, Sinusoidal <10
(1) The sum of the DC supply voltage and AC supply noise should not exceed the recommended supply voltage range.