SNLS530D April   2016  – June 2018 LMH1219

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface AC Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) AC Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  4-Level Input Configuration Pins
      2. 7.3.2  Input Carrier Detect
      3. 7.3.3  -6 dB Splitter Mode Launch Amplitude for IN0
      4. 7.3.4  Continuous Time Linear Equalizer (CTLE)
        1. 7.3.4.1 Adaptive Cable Equalizer (IN0+)
        2. 7.3.4.2 Adaptive PCB Trace Equalizer (IN1±)
      5. 7.3.5  Input-Output Mux Selection
      6. 7.3.6  Clock and Data Recovery (CDR) Reclocker
      7. 7.3.7  Internal Eye Opening Monitor (EOM)
      8. 7.3.8  Output Function Control
      9. 7.3.9  Output Driver Amplitude and De-Emphasis Control
      10. 7.3.10 Status Indicators and Interrupts
        1. 7.3.10.1 LOCK_N (Lock Indicator)
        2. 7.3.10.2 CD_N (Carrier Detect)
        3. 7.3.10.3 INT_N (Interrupt)
      11. 7.3.11 Additional Programmability
        1. 7.3.11.1 Cable Length Indicator (CLI)
        2. 7.3.11.2 Digital MUTEREF
    4. 7.4 Device Functional Modes
      1. 7.4.1 System Management Bus (SMBus) Mode
        1. 7.4.1.1 SMBus Read and Write Transactions
          1. 7.4.1.1.1 SMBus Write Operation Format
          2. 7.4.1.1.2 SMBus Read Operation Format
      2. 7.4.2 Serial Peripheral Interface (SPI) Mode
        1. 7.4.2.1 SPI Read and Write Transactions
          1. 7.4.2.1.1 SPI Write Transaction Format
          2. 7.4.2.1.2 SPI Read Transaction Format
        2. 7.4.2.2 SPI Daisy Chain
    5. 7.5 LMH1219 Register Map
      1. 7.5.1 Share Register Page
      2. 7.5.2 CTLE/CDR Register Page
      3. 7.5.3 CableEQ/Drivers Register Page
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for SMPTE and 10 GbE Applications
      2. 8.1.2 Optimizing Time to Adapt and Lock
      3. 8.1.3 LMH1219 and LMH0324 Compatibility
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detail Design Procedure
      3. 8.2.3 Recommended VOD and DEM Register Settings
      4. 8.2.4 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 PCB Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.