SNLS534D April   2016  – June 2018 LMH1226

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface AC Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) AC Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Input Configuration Pins
      2. 7.3.2 Input Carrier Detect
      3. 7.3.3 Continuous Time Linear Equalizer (CTLE)
        1. 7.3.3.1 Adaptive PCB Trace Equalizer (IN1±)
      4. 7.3.4 Input-Output Mux Selection
      5. 7.3.5 Clock and Data Recovery (CDR) Reclocker
      6. 7.3.6 Internal Eye Opening Monitor (EOM)
      7. 7.3.7 Output Function Control
      8. 7.3.8 Output Driver Amplitude and De-Emphasis Control
      9. 7.3.9 Status Indicators and Interrupts
        1. 7.3.9.1 LOCK_N (Lock Indicator)
        2. 7.3.9.2 CD_N (Carrier Detect)
        3. 7.3.9.3 INT_N (Interrupt)
    4. 7.4 Device Functional Modes
      1. 7.4.1 System Management Bus (SMBus) Mode
        1. 7.4.1.1 SMBus Read and Write Transactions
          1. 7.4.1.1.1 SMBus Write Operation Format
          2. 7.4.1.1.2 SMBus Read Operation Format
      2. 7.4.2 Serial Peripheral Interface (SPI) Mode
        1. 7.4.2.1 SPI Read and Write Transactions
          1. 7.4.2.1.1 SPI Write Transaction Format
          2. 7.4.2.1.2 SPI Read Transaction Format
        2. 7.4.2.2 SPI Daisy Chain
    5. 7.5 LMH1226 Register Map
      1. 7.5.1 Share Register Page
      2. 7.5.2 CTLE/CDR Register Page
      3. 7.5.3 Drivers Register Page
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for SMPTE and 10 GbE Applications
      2. 8.1.2 LMH1219 and LMH1226 Compatibility
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Recommended VOD and DEM Register Settings
      4. 8.2.4 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 PCB Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Recommended SMBus Interface AC Timing Specifications (1)(2)(3)

PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
FSCL SMBus SCL Frequency 10 400 kHz
TBUF Bus Free Time Between Stop and Start Condition 1.3 µs
THD:STA Hold time after (Repeated) Start Condition.
After this period, the first clock is generated.		 0.6 µs
TSU:STA Repeated Start Condition Setup Time 0.6 µs
TSU:STO Stop Condition Setup Time 0.6 µs
THD:DAT Data Hold Time 0 ns
TSU:DAT Data Setup Time 100 ns
TLOW Clock Low Period 1.3 µs
THIGH Clock High Period 0.6 µs
TR Clock/Data Rise Time 300 ns
TF Clock/Data Fall Time 300 ns
(1) These parameters support SMBus 2.0 specifications.
(2) These parameters are not production tested.
(3) See Figure 1 for timing diagrams.