SNOSDC1A June   2024  – October 2024 LMH1229 , LMH1239

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements for Serial Management (SM) Bus Interface
    7. 5.7 Timing Requirements for Serial Parallel Interface (SPI) Interface
    8. 5.8 Typical Characteristics
      1. 5.8.1 TX Characteristics
      2. 5.8.2 RX Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 4-Level Input Pins and Thresholds
      2. 6.3.2 Input and Output Signal Flow Control
        1. 6.3.2.1 Input Mux Selection (LMH1239 Only)
        2. 6.3.2.2 Output Mux and SDI_OUT Selection
      3. 6.3.3 Input Carrier Detect
      4. 6.3.4 Adaptive Cable Equalizer (SDI_IN±, SDI_IN1±)
      5. 6.3.5 Clock and Data (CDR) Recovery
      6. 6.3.6 CDR Loop Bandwidth Control
      7. 6.3.7 Output Function Control
      8. 6.3.8 Output Driver Control
        1. 6.3.8.1 Line-Side 75Ω Output Cable Driver (SDI_OUT±)
          1. 6.3.8.1.1 Output Amplitude (VOD)
          2. 6.3.8.1.2 Output Pre-Emphasis
          3. 6.3.8.1.3 Output Slew Rate
          4. 6.3.8.1.4 Output Polarity Inversion
        2. 6.3.8.2 Host-Side 100Ω Output Driver (OUT0±, OUT1±)
      9. 6.3.9 Debug and Diagnostic Features
        1. 6.3.9.1 Internal Eye Opening Monitor (EOM)
        2. 6.3.9.2 PRBS Generator, Error Checker, and Error Injector
        3. 6.3.9.3 Status Indicators and Interrupts
          1. 6.3.9.3.1 LOCK_N (Lock Indicator)
          2. 6.3.9.3.2 CD_N (Carrier Detect)
          3. 6.3.9.3.3 Cable Fault Detection (SDI_OUT+ Only)
          4. 6.3.9.3.4 INT_N (Interrupt)
        4. 6.3.9.4 Additional Programmability
          1. 6.3.9.4.1 Cable EQ Index (CEI)
          2. 6.3.9.4.2 Digital MUTEREF
    4. 6.4 Device Functional Modes
      1. 6.4.1 System Management Bus (SMBus) Mode
        1. 6.4.1.1 SMBus Read and Write Transaction
          1. 6.4.1.1.1 SMBus Write Operation Format
          2. 6.4.1.1.2 SMBus Read Operation Format
      2. 6.4.2 Serial Peripheral Interface (SPI) Mode
        1. 6.4.2.1 SPI Read and Write Transactions
          1. 6.4.2.1.1 SPI Write Transaction Format
          2. 6.4.2.1.2 SPI Read Transaction Format
        2. 6.4.2.2 SPI Daisy Chain
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 SMPTE Requirements and Specifications
      2. 7.1.2 Optimizing the Time to Adapt and Lock
      3. 7.1.3 Optimized Loop Bandwidth Settings for Diagnostic or Cascade Applications
      4. 7.1.4 LMH1229 and LMH1297 (EQ Mode) Pin-to-Pin Compatibility
    2. 7.2 Typical Application
      1. 7.2.1 Cable Equalizer With Loop-Through
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Cable Equalizer With Redundant SDI Input (LMH1239 only)
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Board Stack-Up and Ground References
        2. 7.4.1.2 High-Speed PCB Trace Routing and Coupling
          1. 7.4.1.2.1 SDI_IN± and SDI_OUT±:
          2. 7.4.1.2.2 OUT0± and OUT1±:
        3. 7.4.1.3 Anti-Pads
        4. 7.4.1.4 BNC Connector Layout and Routing
        5. 7.4.1.5 Power Supply and Ground Connections
        6. 7.4.1.6 Footprint Recommendations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1.6 Footprint Recommendations

  • Stencil parameters for the EP (Exposed Pad) such as aperture area ratio and the fabrication process have a significant impact on paste deposition. Inspection of the stencil prior to placement of the QFN package is highly recommended to improve board assembly yields. If the via and aperture openings are not carefully monitored, the solder can flow unevenly through the EP. Stencil parameters for aperture opening and via locations are shown in the RTV package drawing in the Mechanical, Packaging, and Orderable Information.
  • The EP of the package must be connected to the ground plane through a 3 × 3 via array. These vias are solder-masked to avoid solder flowing into the plated-through holes during the board manufacturing process. Details about via dimensions are also shown in the RTV package drawing in Mechanical, Packaging, and Orderable Information.

More information on the QFN style package is provided in QFN/SON PCB Attachment application note.