SNWS020C November   2007  – October 2015 LMH2100

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Thermal Information
    5. 6.5 2.7-V DC and AC Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Characteristics of the LMH2100
      2. 7.3.2 Accurate Power Measurement
        1. 7.3.2.1 LOG-Conformance Error
        2. 7.3.2.2 Temperature Drift Error
          1. 7.3.2.2.1 Temperature Compensation
          2. 7.3.2.2.2 Differential Power Errors
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
        1. 7.4.1.1 Output Behavior in Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Functionality and Application of RF Power Detectors
        1. 8.1.1.1 Functionality of RF Power Detectors
          1. 8.1.1.1.1 Key Characteristics of RF Power Detectors
          2. 8.1.1.1.2 Types of RF Power Detectors
            1. 8.1.1.1.2.1 Diode Detector
            2. 8.1.1.1.2.2 (Root) Mean Square Detector
            3. 8.1.1.1.2.3 Logarithmic Detectors
    2. 8.2 Typical Applications
      1. 8.2.1 Application With Transmit Power Control Loop
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Detector Interfacing
            1. 8.2.1.2.1.1 Concept of Power Measurements
            2. 8.2.1.2.1.2 RF Input
            3. 8.2.1.2.1.3 Output and Reference
              1. 8.2.1.2.1.3.1 Filtering
            4. 8.2.1.2.1.4 Interface to the ADC
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Application With Voltage Standing Wave Ratio Measurement
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Supply Lines
        1. 10.1.1.1 Positive Supply (VDD)
        2. 10.1.1.2 Ground (GND)
      2. 10.1.2 RF Input Interface
      3. 10.1.3 Microstrip Configuration
      4. 10.1.4 GCPW Configuration
      5. 10.1.5 Reference (REF)
      6. 10.1.6 Output (OUT)
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (March 2013) to C Revision

  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections.Go

Changes from A Revision (March 2013) to B Revision

  • Changed layout of National Data Sheet to TI formatGo