SBOSA05C August   2021  – November 2022 LMH32404

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics: Logic Threshold and Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Clamping and Input Protection
      2. 7.3.2 ESD Protection
      3. 7.3.3 Differential Output Stage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Ambient Light Cancellation (ALC) Mode
      2. 7.4.2 Channel Multiplexer Mode
      3. 7.4.3 Low-Power Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Standard TIA Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Increase Channel Density for Optical Front-End Systems
        1. 8.2.2.1 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20201020-CA0I-0ZQR-ZRMR-B5HVKSWD64KR-low.gif Figure 5-1 RHF Package, 28-Pin VQFN, (Top View)
Table 5-1 Pin Functions
PIN TYPE(2) DESCRIPTION
NAME NO.
EN 9 I Device enable pin. EN = logic low = normal operation (default); EN = logic high = low power mode.(1)
GND 11, 26 I Amplifier ground.
IDC_EN 28 I Ambient light cancellation loop enable. IDC_EN = logic low = enable DC cancellation (default); IDC_EN = logic high = disable DC cancellation.(1)
IN1 1 I Transimpedance amplifier input – Channel 1.
IN2 3 I Transimpedance amplifier input – Channel 2.
IN3 6 I Transimpedance amplifier input – Channel 3.
IN4 8 I Transimpedance amplifier input – Channel 4.
M1 25 I Select Channel 1. M1 = logic high = Channel 1 operational and output switches closed. M1 = logic low (default) = Channel 1 in standby power mode and output switches open. (1)
M2 24 I Select Channel 2. M2 = logic high = Channel 2 operational and output switches closed. M2 = logic low (default) = Channel 2 in standby power mode and output switches open. (1)
M3 13 I Select Channel 3. M3 = logic high = Channel 3 operational and output switches closed. M3 = logic low (default) = Channel 3 in standby power mode and output switches open. (1)
M4 12 I Select Channel 4. M4 = logic high = Channel 4 operational and output switches closed. M4 = logic low (default) = Channel 4 in standby power mode and output switches open. (1)
OUT1– 22 O Channel 1 inverting amplifier output. When light is incident on the photodiode the output pin transitions in a negative direction from the no light condition.
OUT1+ 21 O Channel 1 noninverting amplifier output. When light is incident on the photodiode the output pin transitions in a positive direction from the no light condition.
OUT2– 20 O Channel 2 inverting amplifier output. When light is incident on the photodiode the output pin transitions in a negative direction from the no light condition.
OUT2+ 19 O Channel 2 noninverting amplifier output. When light is incident on the photodiode the output pin transitions in a positive direction from the no light condition.
OUT3– 18 O Channel 3 inverting amplifier output. When light is incident on the photodiode the output pin transitions in a negative direction from the no light condition.
OUT3+ 17 O Channel 3 noninverting amplifier output. When light is incident on the photodiode the output pin transitions in a positive direction from the no light condition.
OUT4– 16 O Channel 4 inverting amplifier output. When light is incident on the photodiode the output pin transitions in a negative direction from the no light condition.
OUT4+ 15 O Channel 4 noninverting amplifier output. When light is incident on the photodiode the output pin transitions in a positive direction from the no light condition.
VDD1 2, 4, 5, 7 I Positive power supply for the transimpedance amplifier stage. Each pin should be tied to the same power supply with independent power-supply bypassing.
VDD2 14, 23 I Positive power supply for the differential amplifier stage. Tie VDD1 and VDD2 to the same power supply with independent power-supply bypassing.
VOCM 27 I Differential amplifier common-mode output control.
VOD 10 I Differential amplifier differential output offset control.
Thermal pad — Connect the thermal pad to the same potential as pin 11 and 26 (GND).
(1) TI recommends driving a digital pin with a low-impedance source rather than leaving the pin floating because fast-moving transients can couple into the pin and inadvertently change the logic level.
(2) I = input, O = output
DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION
381 μm Silicon with backgrind Wafer backside is not electrically isolated and should be held at the same potential as the most negative power supply connected to the die (GND) AlCu
Figure 5-2 Bare Die Package
Table 5-2 Bond Pad Coordinates of Bare Die Version in Microns
PAD NUMBER PAD NAME X-MIN Y-MIN X-MAX Y-MAX
1 IN1 15 1981.075 90 2056.075
2 VDD1 15 1795.225 90 1870.225
3 GND 15 1663.3 90 1738.3
4 IN2 15 1450.675 90 1525.675
5 VDD1 15 1295.225 90 1370.225
6 GND 15 1163.3 90 1238.3
7 VDD1 15 1026.65 90 1101.65
8 IN3 15 898.55 90 973.55
9 GND 15 766.475 90 841.475
10 GND 15 590.775 90 665.775
11 VDD1 15 435.325 90 510.325
12 IN4 15 301.75 90 376.75
13 EN 172.675 15 247.675 90
14 VOD 329.35 15 404.35 90
15 GND 522.85 15 672.85 90
16 M4 718.525 15 793.525 90
17 M3 857.95 15 932.95 90
18 VDD2 1001.725 15 1151.725 90
19 OUT4+ 1176 244.2 1251 319.2
20 OUT4– 1176 552.2 1251 627.2
21 OUT3+ 1176 744.2 1251 819.2
22 GND 1176 864.45 1251 1014.45
23 OUT3– 1176 1052.2 1251 1127.2
24 OUT2+ 1176 1244.2 1251 1319.2
25 GND 1176 1364.45 1251 1514.45
26 OUT2– 1176 1552.2 1251 1627.2
27 OUT1+ 1176 1744.2 1251 1819.2
28 OUT1– 1176 2052.2 1251 2127.2
29 VDD2 1001.725 2285 1151.725 2360
30 M2 857.95 2285 932.95 2360
31 M1 718.525 2285 793.525 2360
32 GND 497.85 2285 672.85 2360
33 VOCM 329.35 2285 404.35 2360
34 IDC_EN 172.675 2285 247.675 2360